EE Product News

Socket Adapters Enable Use Of Existing Boards

The company's latest BGA socket-adapter systems promise to solve reflow temperature mismatch issues when using lead-free devices on existing boards with standard solder profiles. Reportedly, the systems eliminate the extra costs and time delays associated with changing profiles or redesigning boards. In use, lead-free device packages solder to RoHS-compliant adapters in a high-temperature reflow profile. The boards are processed with standard sockets, employing tin/lead solder ball terminals, without changing the board soldering profile. The device/adapter assembly is then plugged into the board-mounted socket after processing. Additionally, integrating the adapter system into RoHS-exempt designs protects components from higher reflow temperatures and eliminates the need to scrap existing boards. For more information, contact ADVANCED INTERCONNECTIONS CORP., West Warwick, RI. (800) 424-9850.


Product URL: Click here for more information

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.