EE Product News

Test Socket Works At 10 GHz

A new high-frequency test socket has been designed for devices from 14 to 27 mm². The RF Center Probe socket is suited for manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1 GHz to more than 10 GHz, such as CSP, MicroBGA, MLF, QFN, DSP, LGA, SRAM, DRAM, and flash devices. A four-point spring probe crown on the socket ensures "scrub" on solder ball oxides for reliable contact mating. For MLF and QFN packages, the socket incorporates a raised point probe for accurate placement and scrub on small pads. With a signal path of 0.77", the RF socket achieves minimal signal loss and higher bandwidth capability. The socket’s pressure-mount compression spring probes are accurately located by two molded plastic alignment pins and secured with four stainless steel screws for fast, easy access when mounting and removing from the load board. Estimated contact life is greater than 500,000 cycles. Center probe contact forces are 9g to 12g per contact for 0.50 mm to 0.75 mm pitches, and 17g to 20g per contact for 0.80 mm pitches and larger. Operating temperature is –55°C to +150°C. Pricing for a 200-lead RF Center Probe socket for 3.5GHz applications starts at $500 each/4. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.


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