Designed for automated or manual testing of packages such as CSPs, BGAs, LGAs or CGAs, these sockets accommodate pitches as fine as 0.5 mm and are standardized on four basic footprints to simplify device-under-test board design. The sockets have spring-loaded contact probes to ensure reliable signal paths. Cycle life is typically 500,000 insertions. Contacts are individually field-replaceable or socket can be refurbished at the factory. The compressed height of the contact probes is less than 5 mm in some designs with inductance values as low as 0.9 nH.
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