Wireless Systems Design

On The Wireless Front

Milpitas, California
Linear Technology now offers the LTC1407A and LTC1407 analog-to-digital converters (ADCs). These 14-b and 12-b, 3-MSample/s ADCs have two simultaneous sampling inputs. Plus, the high-speed serial ADCs are available in a 10-pin MSOP package. At less than half the size of an SO-8, they allow the design of compact, high-speed data-acquisition systems.

The LTC1407A device achieves 73.5-dB SINAD and guarantees 14-b with no missing codes. Its small size, in combination with its high speed and simultaneous sampling capabilities, makes the LTC1407 an ideal choice for medical applications, instrumentation, multiphase motor control, and narrowband I & Q demodulation applications.

The LTC1407A is powered from a single 3-V supply. Its power dissipation is typically 12 mW. When the device is not converting, power dissipation can be reduced to 3.3 mW in the NAP mode with the on-board 2.5-V reference remaining active. It can be reduced to 6 µW with everything powered down in SLEEP mode. The two conversion results are delivered sequentially to high-speed digital-signal-processor (DSP) serial ports via a three-wire serial peripheral interface (SPI). These features support new smaller, lower-power designs for simultaneous sampling applications.

The LTC1407A and LTC1407 ADCs are each now available. They may be purchased in either the commercial or industrial temperature ranges. Pricing begins at $7.00 each for the LTC1407A and $4.00 each for the LTC1407 in 1000-piece quantities. For more information on either ADC or to view the datasheets, go to www.linear.com.

San Jose, California
Sensio and Xilinx, Inc. are now collaborating on a breakthrough three-dimensional (3D) video-processing technology known as SENSIO 3D. Sensio credits Xilinx and its programmable-chip technology with enabling the creative design and economic viability of its SENSIO 3D Video Processing system. The SENSIO system works by transforming the conventional home theater into a 3D stereoscopic movie experience. It is said to rival the best theme-park experience. At its core are Xilinx's low-cost Spartan programmable chips. They provide the central processing capability.

Sensio has met with major motion-picture studios like MGM, IMAX, Dreamworks, LightStorm Entertainment, and TroubleMaker Studios in efforts to build up a library of 3D movies under SENSIO 3D DVD. The company plans to have eight new 3D titles available in 2004 for about $40.00 (Canadian) each. The Sensio system consists of a 17-x-6.25-in. rack-style component that is compatible with commercial DVD and digital-TV systems. It is accompanied by LCD-based wireless viewing glasses. The system is based on the Xilinx processor's ability to alternatively display left and right stereo images and synchronously communicate to the shutters in the viewing glasses. The left-eye and right-eye images alternate every sixtieth of a second, thereby creating the 3D effect for the viewer. Objects can appear to be behind and in front of the screen or shoot right through the audience. The screen itself virtually disappears, bringing the viewer directly into the heart of the action.

Sensio is among a growing number of consumer-product manufacturers to realize the competitive advantage afforded by Xilinx's low-cost programmable chips versus traditional ASIC technology. Xilinx attributes its recent record-breaking gain to its focused market-diversification efforts and the broad adoption of its low-cost Spartan Series FPGAs in high-volume consumer applications.

For more information on this collaboration or details pertaining to Xilinx's programmable chips, go to www.xilinx.com or visit Sensio at www.sensio.tv.

Boise, Idaho
Micron Technology, Inc. is now leading volume production of Double Data Rate 2 (DDR2) memory components. It is the first and only memory supplier to ship DDR2 components in all densities. This includes 256 Mb, 512 Mb, and 1 Gb variations. These components provide the foundation for Micron Technology's line of registered and unbuffered Dual In-Line Memory Modules (DIMM), which range in densities from 128 MB to 4 GB.

Micron Technology led the development of DDR2 through Joint Electron Device Engineering Council (JEDEC) device and module standards work, early product introductions, platform design and demonstration, and validation in customers' systems. It now offers a full complement of DDR2 densities and module configurations. Coupled with its existing position on DDR333/400, this makes Micron Technology uniquely qualified to meet the memory requirements for notebook PCs, emerging dual-channel desktop PCs, and servers.

For more information on Micron Technology's DDR2 memory components, go to www.micron.com.

San Jose, California
Altera Corp. is currently offering the two largest members of the Stratix field-programmable-gate-array (FPGA) family in faster speed grades. With 79,040 and 57,120 logic elements (LEs), respectively, the EP1S80 and EP1S60 members of the Stratix device family are now available in the five-speed grade. They deliver the same high-performance digital-signal-processing (DSP) speeds (333 MHz) and data rates (300 MHz) that are attained with the smaller Stratix FPGA devices. Yet these newly available versions are on average 12% faster.

The EP1S80 and EP1S60 FPGA devices are ideal for logic-intensive applications like image processing, which require both high-density and high-performance devices. They are also excellent design vehicles for HardCopy Stratix devices. The HardCopy devices are Altera's low-risk approach to structured application-specific-integrated-circuit (ASIC) design.

Versions of the Altera EP1S60 and EP1S80 Stratix Family of FPGAs have been shipping for over a year. The newly characterized EP1S60F1020C5 and EP1S80F1020C5 Stratix devices provide up to 22 DSP blocks. They consist of hardware multipliers (up to 176), adders/subtracters, accumulators, and pipeline registers. With speeds of up to 333 MHz, these embedded arithmetic units free up valuable logic resources for other functionality implementations. They also enable faster device performance.

The new Stratix speed-grade options are supported in the Quartus II software. All major third-party synthesis and simulation tools for implementing performance-critical designs also support them. The complete solution for these devices includes board-level simulation tools and Stratix-device-optimized intellectual property (IP). It offers designers unparalleled capabilities to design, test, and optimize complex, high-speed designs.

Both the Stratix EP1S60F1020C5 and EP1S80F1020C5 devices are now available. Pricing for EP1S60F1020C5 devices begins at $380 for 10,000-unit volumes. It starts at $660 in 5000-unit volumes for EP1S80F1020C5 devices.

For more information about these new FPGA products, check out www.altera.com.

The Netherlands
Royal Philips Electronics and Samsung Electronics Co. are now in the process of launching a consumer-electronics-industry interface. Known as the Universal Home Application Programming Interface (UH-API) initiative, this interface creates a new application-programming-interface standard. This standard will allow independent software vendors (ISVs), system integrators, and device vendors to create middleware and application software on top of semiconductor-based systems.

Together, the semiconductor units of Royal Philips Electronics and Samsung Electronics will establish, maintain, and promote the UH-API initiative. Philips and Samsung plan to extend the invitation to other companies as well. These companies will be invited to participate in enhancing and deploying the UH-API specification throughout the consumer-electronics industry in every new product that comes to market.

Both companies will re-align their internal resources to develop UH-API-compliant semiconductor chip sets and solutions. Philips' Nexperia Home semiconductor system solutions, for example, will be UH-API compliant. For its part, Samsung Electronics will initially introduce the new standard to its high-definition-television (HDTV) chip sets. The company also has plans to expand this standard to many of its other applications as well. Drafts of UH-API are expected to be available this quarter.

The UH-API consists of a set of software interfaces for configuring and controlling the audio- and video-related components of a semiconductor platform that targets the consumer market. It is complementary with the leading operating systems across the industry. The UH-API is designed for the semiconductor platforms that address a wide range of target devices. Such devices include the following: analog and digital televisions; set-top boxes; DVD players and recorders; personal video recorders; home servers; and other consumer audio-video devices.

For more details of this emerging standard, check out www.philips.com or www.samsung.com.

Waterloo, Ontario
The SBT-800-BBM Bluetooth module from Super BT Canada is targeted at simple plug-and-play industrial applications that do not require an external host controller. All basic signaling control and data flow take place via an on-board 16-b central processing unit (CPU). As a result, it is very easy to apply this module to such applications as wireless data collection, security, meter reading, sensing, and remote control. Audio and slow-moving video are also viable application areas. The module can be directly accessed through USB, UART, PCM, UART (CPU), and GPIO (CPU) interfaces. Serial on-board programming and debugging are provided through a J-tag interface. For more information on this product or for a complete datasheet, go to www.superbt.com.

Sunnyvale, California
Maxim Integrated Products now offers the industry's first IEEE802.3af-compliant power-over-Ethernet (PoE) DC-DC controllers that integrate an interface controller. They are ideal for use in powered devices, such as Internet-protocol (IP) phones, WLAN access point, and IP cameras. These new Integrated Circuits (ICs)—the MAX5941 and MAX5942—provide regulated power to a device's system, thereby allowing it to be safely powered over the network CAT-5 data cable.

Rated for up to 67-V operation and over 15-W output power, the MAX5941 and MAX5942 allow the design of isolated or nonisolated power supplies. Each controller provides a valid 25-k signature discovery, classification signature, and programmable in-rush current. During detection, these devices draw less than 10 µA of offset current, allowing accurate detection of the 25-k signature.

The MAX5941 and MAX5942 controllers include a current-mode PWM controller with an integrated startup circuit that is suitable for high-performance, isolated or non-isolated power supplies. Other features include current-mode control, leading-edge blanking, soft-start, overcurrent shutdown, undervoltage lockout, and thermal shutdown.

The MAX5941 controller is recommended for isolated forward and flyback converters. The MAX5942 is recommended for nonisolated designs.

The MAX5941 and MAX5942 are available in the extended (40° to 85°C) and commercial (0° to 70°C) temperature ranges in the surface-mount, 16-pin SO package. Prices start at $1.96 for the MAX5941 and $2.07 for the MAX5942 (1000-up, FOB USA). For more details, go to www.maxim-ic.com.

Chelmsford, Massachusetts
Recently, Hittite Microwave announced the release of its first standard-product prescaler fabricated in silicon germanium (SiGe). Complementing the company's extensive product line of MMIC frequency dividers and multipliers, this new Divide-by-4 Prescaler is characterized by its low cost, low power consumption, and excellent phase noise. As a result, it is especially well suited for high-volume synthesizer applications in DBS/CATV, wireless-local-area networks (WLANs), fixed wireless, wireless local loop (WLL), cellular/3G, microwave radio, and very-small-aperture terminals (VSATs).

The HMC426MS8 SiGe MMIC Divide-by-4 Prescaler operates from DC (with a square wave input) to 4-GHz input frequency. It accepts a wide input power range of −15 to 10 dBm. This versatile MMIC divider offers low-additive SSB phase noise, −146 dBc/Hz at around 100-KHz offset, and a high output power of 3.5 dBm. It consumes only 13 mA from a single 3-V supply. It comes housed in an industry-standard SOIC-8 (MS8) leaded surface-mount package.

Samples and evaluation PC boards are now available from stock for sampling or sale. Released datasheets are available online at www.hittite.com.

San Jose, California
In a move designed to drive the 802.16 market, Atmel and Wavesat, Inc. have joined forces. They will launch a chip set for the broadband-wireless-access (BWA) market. In order to accomplish that goal, Wavesat will incorporate Atmel's SiliconCITY capability into the first WiMAX-compliant Institute of Electrical and Electronics Engineers (IEEE) 802.16d chips. WiMAX is a wireless-networking standard with a greater range and bandwidth than the Wi-Fi standard. Wavesat has been working on this Orthogonal-Frequency-Division-Multiplexing (OFDM) modem technology since 1997. This new chip represents the company's sixth generation of an OFDM modem. Already, more than a dozen system makers are using Wavesat's development kits to design next-generation BWA systems.

Wavesat is able to draw upon Atmel's common design infrastructure and qualified intellectual property (IP) to help ensure first-pass silicon success. Because Wavesat's ultimate goal is to create a single-chip system-on-a-chip (SoC), Atmel's SiliconCITY was a logical choice. It is the creative foundation for Atmel's ASIC/ASSP product strategy. It is built on reusable and validated IP and architectures from Atmel's broad line of standard products and ASSPs within its system-on-a-chip portfolio.

Wavesat and Atmel expect to have the BWA DM256 chip available in the second quarter of this year. Using development kits now will enable system manufacturers to offer WiMAX-compliant systems as early as the third quarter of 2004.

For additional information regarding the ongoing WiMAX-compliant chip development, point your cursor to www.atmel.com or www.wavesat.com.

Fairfield, Connecticut
A new Radiometrix Spaceport UHF transceiver—the SPM2-433-28—comes courtesy of LEMOS International Co., Inc. It can operate at speeds of 433.92 MHz, 869.85 MHz, and 914.5 MHz. As a result, it is ideal for applications like PDAs, handheld/portable terminals, EPOS equipment, remote data acquisition, and audience-response systems. In-building environment monitoring and control, security and fire alarms, and vehicle data upload/download are all viable applications as well.

Specific features of the SPM2-433-28 Radiometrix Spaceport UHF transceiver include a data-terminal-equipment (DTE) speed of 600 to 115,200 bps, an air data speed of 600 to 14,400 bps, an outdoor range of 200 m, and an indoor range of 50 m. With dimensions of 23 x 39 x 4 mm, this transceiver offers built-in RF-link diagnostics, built-in command-line configuration, and remote over-the-air unit-configuration capabilities. It can function as point-to-multipoint or broadcast. It also has point-to-point addressability. The transceiver conforms to EN 300 220-3 and EN 301 489-3.

Evaluation kits for the SPM2-433-28 transceiver are now available. Contact the company at www.lemosint.com for more information.

Alameda, California
Wind River Systems is now a member of the Consumer Electronics Linux Forum (CELF). This industry group focuses on the advancement of Linux as an open-source platform for consumer-electronics devices. The forum's current members include Sony, Philips, Panasonic, and other consumer-electronics leaders.

Wind River's decision to join CELF is in line with the company's recent move to support Linux. Its membership further establishes Wind River in the embedded-Linux market. Through its involvement with CELF, the company hopes to make Linux a more robust and dependable technology for use in consumer-electronics devices. As Linux gains momentum with consumer-electronics manufacturers, Wind River will work with CELF to ensure that its products meet the ongoing needs of its customers, including the co-existence of VxWorks and Linux.

In an effort to increase support for Linux across all five of the company's vertical markets—digital consumer, network infrastructure, industrial, automotive, and aerospace and defense—Wind River has begun offering the visionPROBE II software tool. It also has become a member of the Eclipse consortium and Open Source Development Labs.

Wind River's visionPROBE II is an entry-level debug and run-control product. Bundled with WIND RIVER OCD API and one of the company's industry leading debuggers, it provides the perfect solution for test and manufacturing engineers, hardware engineers, firmware engineers, and application engineers. The visionProbe II solution supports VxWorks RTOS awareness, generic RTOS awareness, Linux, and any OS that supports virtual memory by using the processor memory management unit (MMU).

For more information on WInd River's participation with CELF, go to www.windriver.com.

Syracuse, New York
Anaren, Inc. recently introduced the Xinger-brand, 3-dB hybrid coupler for 800-to-1000-MHz applications. This IC403 component offers very low loss. For increased durability in the field, it matches the coefficient of thermal expansion (CTE) of typical power-amplifier PCBs like FR4, G-10, Rogers 4003/4350, and Taconic RF-35 substrates.

With only 0.3-dB loss and power handling better than 115 W, this component is well-suited for AMPS and GSM900 applications. It's even smaller than the company's traditional Xinger-brand 800-to-1000-MHz part. Consequently, original equipment manufacturers (OEMs) save even more board space.

Some of the 3-dB hybrid coupler's key specifications include a high isolation of 20 dB/min., 1:20 maximum VSWR, ±0.25-dB amplitude balance, and ±3° phase balance. Its size is 0.354 x 0.275 x 0.11 in.

Anaren has also now announced a sub-miniature version of the Xinger-brand surface-mount balun. Measuring 3 x 3 x 0.76 mm, the 2.4-GHz part has an insertion loss of 0.55 dB maximum. Thus, it is an excellent companion for 802.11b/g access point and embedded wireless-local-area-network (WLAN) chip sets. The 4.8-to-5.9-GHz part has an insertion loss of 0.5 dB and is directed at 802.11a and world allocations.

According to the company, this part is excellent for reducing insertion losses in integrated chip sets. The balun design also reduces the need for lumped element matching structures, which in turn lowers the total build-of-materials (BOM) component count. As a result, designing it in is easier than ever before. The new part does not even require DC decoupling capacitors. This is due to the use of Anaren's patented inverted balun structure.

Other advantages to the new Anaren balun include guaranteed phase and amplitude performance. Like all Anaren off-the-shelf parts, the femto baluns are also backed by the company's 100% OnSpec guarantee and B-There service commitment, which ensures on-time delivery. Samples are available within 24 hrs. for qualified prototype work. To find out more, go to www.anaren.com.

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