Touted as the lowest profile 0603 and 0805 multilayer organic diplexers available in the global market, AVX’s new MLO diplexers raise the bar with superior attenuation, low insertion losses, low parasitics, high heat dissipation and excellent solderability. Measuring 0.42 mm and 0.55 mm in height, respectively, the 0603 and 0805 diplexers are ideally suited for band switching in dual and multiband systems, such as WiFi and WiMax (WLAN/BT); mobile telecommunications, including 3G and 4G LTE (WCDMA, CDMA, and GSM); and GPS. Based on AVX’s patented multilayer organic high density interconnect technology, the MLO diplexers employ high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in multilayer stack ups. Expansion-matched to PCBs, the devices also provide improved reliability compared to ceramic and silicon components. Rated for temperatures spanning -40°C to +85°C and for maximum power capacities of 4.5 W and 5 W, the low-profile 0603 and 0805 MLO diplexers are 100% tested for electrical parameters and visual characteristics and are available with Ni/Au, Ni/Sn and OSP coatings.
Low-Profile MLO Diplexers Lower Insertion Losses
Measuring 0.42 mm and 0.55 mm in height, 0603 and 0805 diplexers feature superior attenuation, low insertion losses, low parasitics, high heat dissipation and excellent solderability.