Components: Thin-Film Wire-Bond Resistor Chips Handle High Power Levels

Nov. 24, 2003
Though measuring 0.030 by 0.045 in. (PWA) and 0.07 by 0.07 in. (PWB), these series of thin-film wire-bondable resistor chips include power ratings up to 500 mW and 1 W, respectively. The PWA chips are available in values from 0.3 Ω to 1...

Though measuring 0.030 by 0.045 in. (PWA) and 0.07 by 0.07 in. (PWB), these series of thin-film wire-bondable resistor chips include power ratings up to 500 mW and 1 W, respectively. The PWA chips are available in values from 0.3 Ω to 1 MΩ, and the PWB chips come in values of 0.3 Ω to 20 kΩ. Both feature an oxidized silicon substrate, a self-passivating tantalum-nitride resistor material, and operate from −55°C to 125°C. Wire-bondable aluminum or gold pads are available. The resistors are 100% electrically tested and are visually inspected to meet MIL-PRF-38534 standards. Samples and production quantities are available now, with larger quantities in up to eight weeks.

Vishay Intertechnology Inc.www.vishay.com; (401) 738-9150, ext. 131

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