Electronic Design
Modular Cooling Options Foster Heatsink Flexibility

Modular Cooling Options Foster Heatsink Flexibility

The C40 heatsink system developed by Ohmite Manufacturing offers a variety of cooling options. Its flexible board-mounted modular assembly can be used with up to four TO-247 and TO-264 power resistors, or similar-packaged passive and active components. The 58-mm heatsinks can be employed individually or in compact paired configurations. Patented camming clips, which are sold separately, secure the devices in place without the need for holes or screws. Active cooling and enhanced thermal capacity in back-to-back paired operations is made possible with pre-configured mounting holes to accommodate a standard 40- by 40-mm fan. Mounting options include a single extrusion with one or more clips, or two extrusion halves back-to-back with any clip configuration needed to mount the TO package devices. The company can provide custom lengths for additional mounting space.


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