Pairing strength and stiffness, the company’s AlSiC pin fin coolers meet the challenges associated with keeping IGBT power modules cool in hybrid electric vehicles (HEVs). To dissipate heat in the realm 1 kW to 2 kW, the coolers offer pin fin geometries required for effective liquid cooling and provide an isotropic thermal expansion that is compatible with device/electronic substrates to reduce mechanically induced stresses during power thermal cycling. The components’ compatible thermal expansion of 8 ppm/°C reportedly simplifies IGBT assembly compared to Cu pin fin coolers at 17 ppm/°C, eliminating the need for stress compensation layers that increase thermal resistance, assembly complexity, and module cost. For more details, call CPS TECHNOLOGIES CORP., Chartley, MA. (508) 222-0614.
Company: CPS TECHNOLOGIES CORP.
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