Electronicdesign Com Products Components Thermal Putty Keeps High Power Devices Cool36218
Electronicdesign Com Products Components Thermal Putty Keeps High Power Devices Cool36218
Electronicdesign Com Products Components Thermal Putty Keeps High Power Devices Cool36218
Electronicdesign Com Products Components Thermal Putty Keeps High Power Devices Cool36218
Electronicdesign Com Products Components Thermal Putty Keeps High Power Devices Cool36218

Thermal Putty Keeps High Power Devices Cool

Oct. 8, 2008
Said to be one of the most efficient methods for transferring heat from high-power semiconductors to nearby heat sinks and chassis walls, GR-Pm thermal interface putty is a silicone-based material that is very conformable and exhibits a low

Said to be one of the most efficient methods for transferring heat from high-power semiconductors to nearby heat sinks and chassis walls, GR-Pm thermal interface putty is a silicone-based material that is very conformable and exhibits a low compression force at compression rates up to 90%. The putty is suitable for filling small air gaps and uneven mating services as small as 0.3 mm. It complies with UL 94 V-0 flame-retardant specifications and is available in sheets or die-cut forms up to 300 mm x 200 mm. Other features include a thermal conductivity of 6 W/m°K with a thermal resistance ranging from 0.32 to 0.08°Cin.2/W depending on application compression. For pricing, call FUJIPOLY AMERICA CORP., Carteret, NJ. (732) 969-0100.

Company: FUJIPOLY AMERICA CORP.

Product URL: Click here for more information

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