Warwick, UK: The new “iPower” technical conference on power engineering will bring together specialists from science, academia, supply, and industry at The University of Warwick on 30 November and 1 December 2011. The conference, organised by the International Microelectronics And Packaging Society’s UK chapter (IMAPS-UK) and the National Microelectronics Institute (NMI), will join with the University of Warwick’s Electronics, Power and Microsystems Research Group.
The programme aims to provide insight into the field’s latest developments and technologies, including applications, trends and devices, thermal management and efficiency, device fabrication, packaging, test and reliability, assembly materials and technologies, high reliability, and temperature. A total of 16 papers are scheduled for the two-day event.
Conference delegates can also take tours of the SiC & VEF Laboratories on Campus, view electric-vehicle demonstrations from leading UK manufacturers and developers. Poster displays and a number of exhibits will be available for viewing.
The event concludes with the “Power Factor” panel session, which will debate key elements raised in the forthcoming “UK Power Electronics Strategy” document from the Department for Business, Innovation and Skills (BIS).