EE Product News

Packaging Targets RF/Wireless Applications

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Said to be ideal for RF/wireless applications, a new type of wafer scale chip scale packaging (WS-CSP) has been developed to meet increased customer demands. Called Xtreme CSP, the packaging is available through a variety of processes: electroplated, ball placement and single-mask CSP. The wafer scale processing and patented redistribution technology can be used in a variety of applications from baseband functions such as microprocessors, DSP and memory, to RF functions such as power amplifiers, VCOs and LNAs. The electroplated CSP, with ball heights less 200µ, is compatible with SMT. The ball placement CSP, with ball heights greater than 200µ, is also compatible with SMT and designed to avoid underfill. It is currently available in no-lead and low-alpha versions. The single-mask CSP is the most economical and is available in limited design configurations.

TAGS: Digital ICs
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