Electronic Design


Stacking Technology Aids Portable-Device Development
The LP-Stack technology can be used to stack DSPs, ASICs, PLDs, memory, and other logic components, even if each has its own package size, pin count, or pin pitch. By stacking dissimilar components, designers can shorten their development cycles and reduce their development costs. They also will be able to incrementally enhance performance without requiring the next generation of chips. This ability especially suits wireless Internet devices, portable computers, PDAs, cable set-top boxes, pagers, cell phones, and broadband network and telecom switches.

Contact the company for pricing and availability information.

Dense-Pac Microsystems, 7321 Lincoln Way, Garden Grove, CA 92841-1431; (800) 642-4477; fax (714) 897-1772; Internet: www.dense-pac.com.

Sensor Measures Power Windows' Compliance With Federal Standard
Automotive designers can use the 10293-450 Pinch Force Sensor to test the spring rates and displacements of automatic window, door, and sunroof closing mechanisms against Federal Motor Vehicle Safety Standard FMVSS-118. This device uses interchangeable gripping packs and adjustable initial "gaps" to check these power-operated systems. Users "clip" the sensor to the window and actuate the closer. A companion instrument then records the peak force for specification verification. The sensor measures forces up to 200 N, spring rates from 2 to 65 N/mm, and displacements from 6 to 200 mm. It can be mated to other instrumentation for development applications as well.

Contact the company for pricing and availability information.

Sensor Developments Inc., P.O. Box 290, 1050 Silver Bell Rd., Lake Orion, MI 48359-02909; (888) SENSOR-1; fax (248) 391-0107; www.sendev.com.

Sensor Pair Measures Metal Diaphragm Strain And Distortion
The AST 3000 uses a chemical vapor deposition technique to form micro strain-gauge structures to measure stainless-steel diaphragm distortion. Its stainless-steel construction doesn't have any internal O rings or fluid-filled cavities, suiting it for rugged environments. All models feature up to 100-V/m EMI/RFI protection. Its operating pressure ranges from 25 PSI (1.5 Bar) to 10,000 PSI (700 Bar). The strain-gauge output is digitally compensated via an ASIC. Operating temperature ranges from −40°C to 120°C.

The AST 4000's bulk-silicon MEMS strain-gauge technology measures strain on metallic diaphragms. Machined from a single piece of stainless steel or nickel alloy, the pressure port and diaphragm provide a true hermetic leak-proof seal against harsh media. Its over-pressure rates at three times, while its burst pressure rates at 10 times. Vertically integrated, this sensor provides the system integrator with full flexibility in design configuration and cost. Pressure ratings up to 10,000 PSI are part of the standard offerings.

OEM pricing starts at $55 for the AST 3000, and $40 for the AST 4000.

American Sensor Technologies Inc., 12 Orben Dr., Unit 1, Landing, NJ 07850; (973) 398-9900; fax (973) 398-9901; Internet: www.astsensors.com.

Sensor Reads Internal Temperature Of Kilns With ±1.7°C Accuracy
The 1400B digital temperature-measurement system provides one to six channels of continuous internal-temperature data on rotating waste incinerators, cement finish mills, kilns, and dryers. Its thermocouples provide direct internal-temperature readings of process material with ±1.7°C accuracy. Then, its telemetry system transmits the data, without the use of slip rings, to a receiver that converts it to a 4- to 20-mA signal. This system isn't affected by nearby handheld communication transmitters. No maintenance is required. Housed in NEMA 4X stainless steel, the 1400B is designed for rugged use in internally and externally fired kilns from 1 to 20 ft. in diameter.

Contact the company for pricing information.

Wireless Data Corp., 2080 Arlingate Lane, Columbus, OH 43228; (800) 227-8190; fax (650) 967-7727; www.wirelessdatacorp.com.

Tiny Digital Temperature Sensor Fits Microcontroller Applications
The LM74 digital temperature sensor comes in a 1.6-mm2 micro SMD package. It's designed for use in next-generation disk drives, wireless phones, test and measurement equipment, game consoles, and other microprocessor/microcontroller-based applications. Additionally, it boasts a 12-bit plus-sign temperature resolution (0.0625°C/LSB). When operating between −40°C and 120°C, it's compatible with SPI/Microwire. Operating from a 2.65- to 5.5-V supply, it typically requires only 265 µA of supply current. Its serial bus remains active in shutdown mode, while current draw lowers to 3 µA between serial communications.

The chip-scale leadless package is applied to the die entirely at the wafer level. With a 0.5-mm bump pitch, the micro SMD solder bumps provide the thermal path from the die directly to the pc board. Furthermore, this sensor consists of a band-gap temperature-sensing circuit, a gain stage, and a 13-bit delta-sigma analog-to-digital converter (ADC). Its three-wire SPI/Microwire interface permits operation as a slave to most popular microcontrollers. The band-gap circuitry acts as a sensor, and the gain stage amplifies the LM74's signal for measurement by the ADC.

In 1000-unit quantities, the LM74 costs $0.85.

National Semiconductor, 2900 Semiconductor Dr., P.O. Box 58090, Santa Clara, CA 95050; (408) 721-5000; www.national.com.

Low-Profile Accelerometers Have 3-PC/G Charge Sensitivity
The 7000 series of top-connector accelerometers uses a conventional 10-32 coaxial connector and cable assembly. These shear-mode devices feature a 3-PC/G charge sensitivity and a frequency response up to 6 kHz. Available in adhesive-mount or fixed-stud configurations, they weigh 2.5 to 4.0 g and measure 0.175 to 0.250 in. high.

Contact the company for pricing and availability information.

Columbia Research Laboratories Inc., 1925 Mac Dade Blvd., Woodlyn, PA 19094; (800) 813-8471; fax (610) 872-3882; www.columbiaresearchlab.com.

TAGS: Digital ICs
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