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Company Wire

IC maker Analog Devices and Minebea Co. of Japan, a manufacturer of motors and machinery products, will work together to develop resolver systems for the automotive market. Their goal is to produce reliable high-performance resolver systems priced below existing solutions. The systems will target applications such as electric power steering, starters and generators, and hybrid electric vehicles. Analog Devices will provide resolver-to-digital converter chips for Minebea to use with its resolvers.

3M has acquired a single-chip module substrate business from W.L. Gore & Associates. The business unit, also known as the high-density multilayer IC packaging business, will become part of the 3M Electronic Products Division. When combined with 3M's flexible circuit products, the technology from W.L. Gore & Associates will create a broad portfolio of IC packaging solutions for the high-end computing and telecom markets.

Two automotive suppliers, Dana Corp. and Motorola's Automotive and Industrial Electronics Group (AIEG) Inc., are partnering to develop integrated automotive system solutions. Dana will incorporate the electronics technology supplied by Motorola within its chassis, drivetrain, and engine systems.

CAE software producer ANSYS Inc. and MEMSCAP Inc., a provider of MEMS commercial design technology, have entered into a long-term business and technology agreement that will offer customers a unified development environment for the design and analysis of MEMS-based products. MEMSCAP's new environment, MEMS Xplorer for Unix and MEMSPro for PCs, includes the integrated ANSYS/multiphysics software. It supports Cadence Design Systems, Mentor Graphics, and Tanner EDA tools. Under the agreement, MEMSCAP becomes a primary worldwide sales and support channel for the integrated environment.

Chip Supply Inc. and Aehr Test Systems plan to jointly produce known good die (KGD) unpackaged semiconductor devices. Under their agreement, Aehr's patented DiePak Carrier products will be used by Chip Supply to offer burn-in and testing services of the bare die and ultimately provide a total solution. This partnership will eliminate the need for manufacturers entering KGD programs to add such equipment as automated die handlers, loaders, and test and burn-in systems.

Spirent Communications has acquired InfoSOFT Technologies Inc., a supplier of a wide range of tools to the CDMA industry. In combination with the newly acquired products, Spirent now offers wireless test instruments to provide end-to-end solutions, speeding product development and simplifying deployment. These solutions will give a jolt to the evolution of 2.5G and 3G wireless services.

RF Micro Devices Inc. has announced plans to develop and manufacture ICs that use indium phosphide (InP). A growing list of fiber-optic applications will benefit from this next-generation semiconductor process technology. InP has better thermal characteristics, higher frequency response, and lower threshold voltages than existing technologies.

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