42 V Quad Synch Step-Down DC/DC Converter Delivers 93% Efficiency
Linear Technology's LT8602 42 V input capable, synchronous monolithic step-down switching regulator combines two high voltage 2.5 A and 1.5 A channels with two lower voltage 1.8 A channels providing four independent outputs and delivering voltages as low as 0.8 V. For always-on systems, a synchronous rectification topology delivers up to 93% efficiency while Burst Mode operation keeps quiescent current under 30 µA (all channels) in no-load standby conditions. The regulator utilizes its pulse-skipping mode to reduce noise and meets CISPR25, Class 5 EMI requirements. Switching frequency can be programmed from 250 kHz to 2.2 MHz and is synchronizable throughout this range. A 60 ns minimum on-time enables 16 VIN to 0.8 VOUT step-down conversions while switching at 2 MHz. Each channel maintains a minimum dropout voltage of 200 mV (at 1 A) under all conditions, and with its 3 V to 42 V input voltage range, the device is suited for automotive applications that must regulate through cold-crank and stop-start scenarios.
The LT8602 is packaged in thermally enhanced 40-lead 6 x 6 mm QFN. Three temperature grades are available with E- and I-grades operating from –40°C to 125°C (junction). Pricing starts at $5.35 each/1,000 with all versions available from stock.
COMe Module Improves Video Transcoding and 3D Rendering
The Express-BL is ADLINK's first COMe Basic Size Type 6 module incorporating the latest Intel Xeon E3-1200 processor and Intel Core i7 processor with Intel QM87 Chipset. It features improved graphics and processing performance and is suited for carrier-grade edge device solutions that demand intense graphics performance and multitasking capabilities in a space-constrained environment, such as industrial cloud and media servers performing real-time video transcoding for CDNs, NFV, and medical imaging applications. In ultra-high resolution ultrasound systems requiring intensive 3D imaging calculations, the module can utilize its integrated GPU as a coprocessor with the use of an OpenCL software layer. The Intel Xeon processor with integrated Iris Pro Graphics 6300 avoids the need for a discrete coprocessor.
The COMe module supports up to 32 GB of dual channel DDR3L memory at 1,600 MHz and provides three DDI channels, as well as LVDS and VGA display outputs. eDP is optionally available. The module also provides high-bandwidth I/O, including one PCIe x16, seven PCIe x1, GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0. The Express-BL COMe module is available in an Extreme Rugged version with an operating temperature range of -40°C to +85°C.
Complete USB Type-C Portfolio Focuses On Small Footprint/Low Power
Fairchild's comprehensive portfolio of USB Type-C solutions seeks to smooth the addition of next generation USB functionality to smartphones, computers, power adapters and other devices. Compared to alternatives, the smaller size and lower power requirements of the USB Type-C solutions can help manufacturers to develop sleeker devices that consume less system power for better energy efficiency. Several of the USB Type-C solutions perform basic features such as detect attachment, orientation and device type (Dual Role Port, Downstream Facing Port, and Upstream Facing Port), while others support more advanced functionality, such as data role swap, power role swap, hard reset, soft reset, active cable support, VDM packet transmission and high power charging up to 100 W. The devices integrate into smaller product designs, in particular, the model FUSB302 comes in a 1.2 x 1.3 mm WLCSP package to give manufacturers more flexibility in their size constrained designs. USB Type-C solutions use an I2C interface to communicate with the application’s host processor for control and command, negating the need for an integrated microprocessor.
30 W Discrete GaN on SiC HEMT Optimizes Power at High Drain Bias
The TriQuint T2G4003532 discrete GaN on SiC HEMT RF power transistor from Richardson RFPD operates from dc to 3.5 GHz and is constructed with TriQuint’s TQGaN25 production process, which features advanced field plate techniques to optimize power and efficiency at high drain bias operating conditions. The RF power transistor provides 28 W at 3.5 GHz of output power (P3dB), a linear gain of >16 dB at 3.5 GHz, and an operating voltage of 32 V. The new device is suitable for military and civilian radar, professional and military radio communications, test instrumentation, wideband or narrowband amplifiers, and jammer applications. The HEMT RF power transistor vailable in flanged (T2G4003532-FL) and flangeless (T2G4003532-FS) low thermal resistance packages, Richardson also offers full design support capabilities. Two evaluation boards are available for the T2G4005528-FS, one is tuned to 2.7–3.5 GHz for S-band radar, and the other is tuned to 1.0–1.4 GHz for L-band radar.
COMe Basic Modules Feature Intel Core i7 Processors and HM76 Chipsets
The AMB-HM76B1FL and AMB-HM76B1 are ACROSSER's two latest embedded COMe Type 6 basic modules both containing two DDR3 SO-DIMMs, for a memory capacity of up to 16 GB. Both COMe basic modules support Windows 7, LINUX Kernel 3.3, and LINUX Kernel 3.5. The main difference between the two boards is the cooling fan system. Built with performance-based customers in mind, the AMB-HM76B1 is equipped with a fan on its board. For customers who work with COMe modules in dusty, difficult environments, or who want to integrate the module into an open-frame chassis, the fanless AMB-HM76B1FL might be a more viable option. The COMe modules are well suited for upgrading projects due to their ease of installation and removal. Systems integrators can keep their current I/O baseboard and swap in a new AMB-HM76B1 COMe module to optimize their current system, a widely accepted upgrade method in embedded computing.
Ruggedized mPCIe Embedded CAN Bus Adapter Enables IoT
The EMUC-B201 from Innodisk is a ruggedized mPCIe embedded peripheral module that provides dual channel CAN Bus 2.0A/B functionality to embedded or industrial PCs for IoT. With CANBus widely used in both vehicle sensor and subsystem communication as well as factory automation and control systems, the peripheral module enables embedded systems for the Internet of Vehicles and industrial PCs for Industry 4.0 as well. The module can interface two CAN Bus channels through either the mPCIe connector or a direct pin header connection for USB 2.0 communication with the main system. Both high speed CAN 2.0B and lower speed fault-tolerant CAN 2.0A are supported.
The CAN Bus adapter can connect to a host system through an mPCIe physical interface and also has 3 mounting holes for mounting directly onto an embedded motherboard and connected through a direct USB 2.0 pin header connection on the card. Other features include a 30u Gold Finger connector, strong shock and vibration resistance, and CAN Bus connections that are galvanic isolated to 2,500 V. The EMUC-B201 mPCIe embedded peripheral module operates across a variety of temperatures from -40°C to 85°C.
Key Connectivity Solutions Enhance Intel OPA
TE Connectivity is providing its STRADA Whisper backplane connectors and cable assemblies, internal cable assemblies, and I/O connectors for Intel’s new switch and other products that are part of the Intel Omni-Path Architecture (OPA) and the Fabric Builders program. TE expects the connectivity solutions to be instrumental in enabling Intel OPA to deliver leading end-to-end performance and density for current and future HPC workloads. STRADA Whisper is a backplane connector and cable assembly solution that transfers data at 25 Gbps, offers scalability up to 56 Gbps, operates with extremely low noise, low insertion loss and little to no skew. The internal cable assembly is an eight-channel cable assembly providing 25 Gb/channel performance, and is available in two different lengths to facilitate various design configurations. TE is also a licensed supplier for the I/O connector solution that connects the internal cable assembly to the external cable assembly.
Rugged Mission Computer Achieves 8 TB of High-Speed Storage
Elma Electronic's StorSys-3000 is an exceptionally high-capacity NAS mission system that withstands harsh, rugged environments for use in IP-based military and defense applications. The 3U VPX computer includes dual 10 GbE ports that feature integrated TCP/IP offload engines. This frees up the 2.5 GHz Core i7 processor enabling critical resources to be directed to mission compute tasks, while obtaining optimal link speeds on each input port. These ports, as well as additional I/O such as a VGA, two USB 2.0, three GPIO and an additional two GbE ports, are utilized via MIL-C-38999 connectors on the front end. The box’s rugged construction, fast processing and ample storage are suitable for high-bandwidth, intensive data processing and storage applications including radar, thermal, hyperspectral and sonar imaging plus SIGINT gathering applications. A four slot storage array supports over 8 TB of solid state MLC storage with RAID protection and high-speed data access speeds of 1.2 GB/sec. Designed for use in extended temperature ranges from -40°C to +75°C, the StorSys-3000 mission system incorporates fanless, conduction cooling and a high CFM front-to-back air flow for added heat dissipation.
Ultra-small RTOS Adds Features and Speed Optimizations
A major release, µ-velOSity 2.6.2, of Green Hills Software's ultra-small footprint RTOS provides new support for the latest processor architectures, improved performance optimizations, and expanded security and safety features. µ-velOSity combined with the MULTI IDE offers an ultra-small and fast software platform to develop and run applications on resource constrained devices such as IoT wearables, home automation and connected industrial sensors. Features and performance optimizations in the update include: support for new processor architectures, secure communicating over untrusted networks and secure networking protocols SSL/TSL and SSH, and CAN bus support for automotive customers. Designed to use the smallest number of CPU clock cycles and memory, the RTOS requires only 1.6 KB of ROM while enabling “instant-on” booting, faster execution speed and more memory for applications. Integrated middleware saves significant development time when adding communication, connectivity and graphics capability, and the comprehensive MULTI IDE enhances development. Key feature advantages include kernel aware debugging, record-setting C/C++ compilers and integrated code quality tools providing developers control and visibility into stack performance, run-time errors and MISRA-C adherence. Complete source code for the µ-velOSity RTOS and select middleware is included.
Advanced Optical Sensor Module Integrates Multiple Functions
The TMx4903, ams AG's new series of advanced optical sensing modules integrates multiple functions including universal remote control, barcode emulation, RGB color sensing, proximity and 3D gesture detection in a low-profile 5.0 x 2.0 x 1.0 mm package. By integrating the multiple optical sensing functions, and an IR LED in one module, the devices help simplify smartphone board layouts. The module variants in the series, the TMD4903 and TMG4903, perform accurate color and proximity sensing, and integrate an IRBeam IR pattern generator. The generator emits remote control beam patterns for any standards-compliant consumer product. The URC capability is also compatible with the Android Consumer.IR programming interface for remote-control applications on smartphones. Mobeam 1D barcode emulation for use at retail POS terminals is also supported. The device also provides advanced touchless IR gesture-sensing capability. The new 3D gesture technology enables the recognition of complex hand gestures, supplementing simple north-south and east-west 2D gestures supported by the TMG3992 gesture sensor. The TMD4903 and TMG4903 are available now in production volumes. Unit pricing for the TMD4903 is $2.00, and $2.50 for the TMG4903 each/1,000.