Toshiba Corp. has joined IBM's team of semiconductor Alliance Partners to develop 32-nanometer CMOS process technology. Toshiba joins Advanced Micro Devices (AMD), Samsung Electronics, Freescale Semiconductor, Infineon Technologies, and Singapore's Chartered Semiconductor Manufacturing in the alliance. The seven companies have agreed to co-develop next-generation technology to create energy-efficient 32-nanometer chips. Since December 2005, IBM and Toshiba have worked together in researching 32-nm process technology at facilities in Yorktown and Albany, N.Y. The new agreement is an extension of this joint-development work, which will now include 32-nm bulk CMOS process technology. Shozo Saito, president and CEO of Toshiba's Semiconductor Company, said Toshiba will accelerate development of integration technology for the 32-nm process at its Advanced Microelectronics Center in Yokohama.