Capable of fully curing at ambient room temperatures, the F112 line of fiber optic adhesives are reported to be a high-strength, low-stress epoxy suitable for potting, sealing and making connectors. The adhesives are also said to target photonics applications such as potting and sealing lenses and LEDs as well as making connectors and laminates. Low stress F118 can be used for single or multi mode connectors along with potting and sealing applications. For more details, contact TRA-BOND, Bedford, MA. (800) 872-2661.
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