The 776 series of chip-scale package (CSP) sockets employ patent-pending retention arm technology, which relies on a vertical contact load methodology and a proprietary latching mechanism that holds devices down against its contact system by applying an equal and opposite load. This approach is said to virtually eliminate any concern of interconnecting to low profile solder balls. Additionally, the socket's buckle-beam contact has a U-shaped tip to reach the outer regions of the ball diameter, thereby eliminating deformation in the no-touch zone. Other features include two different types of contacts for either eutectic solder balls or lead-free solder balls. WELLS-CTI UMD TECHNOLOGY INC., Phoenix, AZ. (800) 348-2505.
Company: WELLS-CTI UMD TECHNOLOGY INC.
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