The company has teamed with Gould Electronics to develop high-performance flexible materials with electrodeposited (ED) copper foils. It has made available its R/flex flexible circuit materials with the ED foils. The new laminates were developed by combining Gould's line of JTCDF specialty copper foils with the firm's proprietary high-performance R/flex 1000 and R/flex Crystal adhesive systems. These foils offer a fine grain structure, making them well suited for dynamic flex applications where frequent bending is expected. The new laminate versions are available in widths from 12" to 48". The higher tensile strength of ED foils helps make the laminates easier to handle and less prone to damage during processing.
Company: ROGERS CORP. - Circuit Materials Division
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