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Hybrid Microcircuits Available With MIL-STD Packaging

Hermetic packaging of industry-standard die and up screening of components makes a line of hybrid microcircuit capabilities suitable for military applications. The packaged die service includes assembling, sealing, and screening the packages to MIL-STD-883 specifications, including leak, centrifuge, temperature cycle, burn-in, and electrical testing. The company also supports quality provisions such as traceability, visual inspection, and in-line QCI requirements. The company is on the DSCC Qualified Manufacturer List of hybrid electronics suppliers, and its products meet the requirements of MIL-PRF-38534, Class H. TT ELECTRONICS BI TECHNOLOGIES, Fullerton, CA. (714) 447-2345.


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TAGS: Components
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