Right-angle Interconnects Suit Solderless Assembly

April 9, 2007
The Autoheader line of right angle interconnects address solder-free, lead-free assembly applications that involve restricted clearance such as stacked PCBs, junction-box assemblies, or automotive connector modules and switches. They employ

The Autoheader line of right angle interconnects address solder-free, lead-free assembly applications that involve restricted clearance such as stacked PCBs, junction-box assemblies, or automotive connector modules and switches. They employ eye-of-the-needle AutoPliant technology, which has undergone extensive qualification testing for use in automotive applications. Based on SAE/USCAR2 Revision 4 and IEC 60352-5 standards, test parameters include thermal shock, mechanical shock and vibration, plus temperature and humidity cycling. The right angle interconnects are available in a variety of pin-header configurations including 0.64 mm x 0.64 mm square pins on a 2.5-mm pitch. Both single-row and dual-row components are available. AUTOSPLICE INC., San Diego, CA. (800) 535-5538.

Company: AUTOSPLICE INC.

Product URL: Click here for more information

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