EE Product News

Solder Spheres Suit BGA Technologies

The most popular BGA technologies, including ceramic BGAs, plastic BGAs, and tape automated bonding BGAs, will benefit from precision solder spheres, which are said to be ideal for the most exacting BGA, chipscale and flip chip applications. These spheres feature superior surface condition, dimensional accuracy and sphere-to-sphere tolerance consistency. Available in diameters ranging from .0005" to /125" with purities up to 99.999%, the spheres are manufactured to J-STD-006 specifications and are available in a wide range of custom and standard alloys.


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TAGS: Components
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