Capable of packing 64MB into a single package, the 512-Mb SDRAM PC100/PC133 DDP (double density packaging) devices come in x4-, x8- and x16-bit organizations. Maintaining the same footprint as a single-chip 256-Mb SDRAM memory module makers can achieve twice the density without increasing the standard module size. These 3.3V DDP devices have the same form, fit and function as a monolithic device, and come in a standard 54-pin, 400-mil TSOP that is backward compatible with 128-Mb and 256-Mb DRAMs.
Company: HITACHI SEMICONDUCTOR AMERICA INC.
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