EE Product News

Dual CPUs Lower 3G Multimedia Handset Costs

Integrating a dual CPU architecture on a single chip, the MSM7xxx family promises to reduce the cost of third generation 3G multimedia handsets. One processor on the chip is optimized for multimode modems and timing functions. Closely coupled to the first processor, the second is employed as a general-purpose processor. Chipsets in the family support existing 3G standards, including CDMA2000 1X/1xEV-dO and WCDMA, and are compatible with GPRS, GSM and IS-95 standards. New modem technology support includes CDMA2000 Revision D, high-speed downlink packet access (HSDPA), 802.11 and GPS. The applications processor employs an ARM11 that operates at speeds from 300 MHz to 1 GHz while the multimode modem relies on an ARM9 processor. Other integrated features include support for 2D and 3D graphics and video encode and decode. Samples will be available in 2004. For more details, call Anita Hix at QUALCOMM INC., San Diego, CA. (858) 845-7571.


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TAGS: Digital ICs
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