Analog Devices LT8374 Synchronous Step-Down LED Drivers have fixed-frequency and peak current control. The LED current is programmed by a resistor from the CTRL pin to ground or by applying a PWM signal to the CTRL pin.

Altera / Intel® Cyclone® IV FPGAs are targeted to high volume, cost-sensitive applications, enabling system designers to meet increasing bandwidth requirements while lowering costs. Cyclone® IV devices are ideal for low-cost, small-form-factor applications in the wireless, wireline, broadcast, industrial, consumer, and communications industries.

Micron LPDDR4 Memory offers 33% faster peak bandwidth compared to DDR4 and 5 times lower power consumption in standby mode compared to standard DRAM. These Memory Devices feature Multi-Chip Package (MCP) and Package-on-Package (PoP) designs that save PCB space.

ST ISM330IS and ISM330ISN iNEMO Inertial Modules are a system-in-package combing 3-axis digital accelerometer and gyroscope with an intelligent sensor processing unit, and machine learning libraries. This integrated solution boosts performance at 0.59mA in high-performance mode and enables always-on low-power features for optimal motion results in industrial and IoT applications.

TE Connectivity's (TE) RP20 Multi-Port MIMO Omnidirectional Antennas are 5G/cellular 2x2 antennas for Fixed Wireless Access applications. RP20 antennas are available in 2- and 3-port variants, with the 3-port models featuring GNSS coverage. These antennas cover a frequency range of 617MHz–6000MHz and support all major global 5G Cellular bands.

Renesas / Dialog DA14695 Multi-Core BLUETOOTH® 5.2 Modules are based on the SmartBond DA14695 Bluetooth low energy 5.2 system on chip (SoC). The Renesas / Dialog DA14695 Modules use all the DA14695 hardware features and capabilities. The modules integrate all passives, antenna, and a 32Mbit QSPI FLASH.

TDK PowerHap™ Development Starter Kit provides users with a first impression of haptic feedback with PowerHap piezo actuators. This kit demonstrates how mechanical integration works and offers a reference design that can be adapted to various applications.

The APSC/APCI series features a ferrite magnetic shield wire-wound design with a 0.47μH–1000μH inductance range. The APCA series withstands temperatures of ≤+180°C with no thermal aging. The AEC-Q200-compliant ADCC series has a half L-shaped termination and improves external termination solderability.