| | | | | | | | On International Talk Like a Pirate Day, Andy covers NI’s new USB-based multichannel data-acquisition instrument, the mioDAQ, suitable for reverse engineering as well as bench and production test. |
|
|
|
| |
| | |
|
|
| | | | | | | | The Raspberry Pi AI Kit comes with an M.2 HAT+ and Hailo AI acceleration module capable of pushing 13 TOPS. |
|
| | |
| | | | How are you working sustainability principles into your supply chain? How involved are your suppliers in that process? And what would make it easier for you to make even more progress on this front? The Electronic Design team is partnering with our colleagues at Endeavor Business Intelligence, the specialized research division of our parent... |
|
| | |
|
| |
| | |
|
|
| | | | Sponsored | | | | The automotive sector is rapidly advancing, with semiconductor memory and storage markets expected to soar from $4 billion in 2021 to $10 billion by 2025. Discover how emerging megatrends will triple DRAM and quadruple NAND in vehicles, shaping the future of automotive technology. |
|
| | |
|
| |
| | |
|
|
| | | | | | | | Large performance gains with minimal changes are possible by optimizing convolutional neural network models. |
|
| | |
| | | | Frore Systems takes advantage of MEMS to blur the lines between active and passive cooling technology. |
|
| | |
|
| |
| | |
|
|
| | | | | | Sponsored | In this webinar, we will discuss how the COMSOL Multiphysics® software can be used to simulate and analyze common issues in the packaging and testing of electronic devices, including semiconductor devices. We will cover topics such as modeling electrical performance verification of packaging, thermal management designs, stress and warpage caused by reflow soldering processes, and more. |
|
|
| | |
| |
| | |
|
|
| | |
|
| | |
|