With next-generation superchips operating at 2,800 W and beyond, liquid cooling has become a critical component in data centers and AI factories. This article lays to rest some of the most common misconceptions around this game-changing technology.
Part 2 presents more of the latest EDA tools that engineers can use to handle bigger chips, tighter nodes, and shorter schedules without signing off on quality.
Consumer demands for sleek products crammed with high-function hardware means that engineers must explore new, and faster, ways to analyze the thermal properties of their designs.
