It integrates an ultra-low-power multiprotocol 2.4 GHz radio and MCU functionality featuring a 128 MHz Arm® Cortex®-M33 processor, comprehensive peripheral set, and scalable memory configurations up to 1.5 MB NVM and up to 256 KB RAM.

Essentra Elastomer Fan Mounts replace screws with a flexible, vibration-dampening solution. Made for DC and AC fans, they reduce noise, fit various fan heights, and allow assembly in restricted spaces. Ideal for electronic and industrial cooling systems requiring reliable performance.

The CCR series offers convection, conduction and fan-cooled ratings in a compact 1" profile. Featuring Class B conducted and radiated emissions, ITE and medical safety approvals, 2 x MOPP isolation and low leakage currents, the CCR550 is designed for medical (BF) and industrial technology applications.

The TPR50 series delivers exceptional precision and stability with a wide input range of 3V to 15V and fixed outputs from 1.25V to 5V. With ultra-low drift (2.5 ppm/°C) and high accuracy (0.05%), it’s ideal for demanding applications like medical equipment, battery test systems, and precision instrumentation. Available in SOP8 and MSOP8 packages, operating –40°C to +125°C

The RRS20 Series is a fully sealed, power rated rocker switch with a variety of customization options. It fits a 20mm round cutout and is available with SPST or SPDT contacts. The switch’s IP68 seal, UL and ENEC listed electrical ratings (up to 16A) and illumination potential (five different actuator colors) combine to make this rocker an in-demand solution for many markets and industries.

These multilayer metal power inductors are offered in a wide range of case sizes, including 1005 to 2016. The modules offer four electrode options and a maximum thickness ranging from 0.33 mm to 1 mm. The LSCN series operates in a -40°C to +125°C temperature range (including-self-generated heat). TAIYO YUDEN LSCN power inductors are ideal for general electronic equipment in consumer applications.

From blink to think. A cutting-edge board for advanced electronics applications, offering enhanced performance, greater flexibility, and improved connectivity compared to its predecessors.

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