XPedite8370 is a secure, high-performance, 3U VPX-REDI single board computer based on the Intel® Core™ Ultra processor (Series 3) (formerly Panther Lake) and aligned to the Sensor Open System Architecture (SOSA) I/O Intensive profile. XPedite8370 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect sensitive data.

Master Bond MasterSil 323S-LO is an addition cured silicone that is electrically and thermally conductive. This material is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments. It can withstand aggressive thermal cycling and mechanical shock, while offering a wide service temperature range from -80°F to +400°F [-62°C to +204°C].