| | | | | | | | Check out the latest stories, videos, and podcasts from the week of Feb. 2, 2026. |
|
|
|
| |
| | |
|
|
| | | | | | | | TI said the tie-up with Silicon Labs positions it to be a leading provider of wireless connectivity solutions for the IoT. |
|
| | |
| | | | AI continues to be a driving force for Ethernet developments. This article forecasts the opportunities and challenges Ethernet technology will face in 2026 to keep up with the AI demand. |
|
| | |
| | | | New workload demands are turning data handling into a system-level design challenge rather than a back-end afterthought. |
|
| | |
| | | | TDK's 900-V ~ 2,000-V ModCap UHP capacitors integrate a PP-COC blend dielectric rated 25°C higher than standard film capacitors, enabling more compact DC-link designs for renewable energy, EV, and industrial drive applications. |
|
| | |
|
| |
| | |
|
|
| | | | Sponsored | | | | Join us to learn how to model and optimize phased-array antennas using an RF Module. See how simulation can guide design decisions and improve performance for 5G, 6G, radar, and satellite systems |
|
| | |
|
| |
| | |
|
|
| | |
|
| | |
|
