Cases Help Control Component Temperature

Oct. 1, 2000
Available in specific material formulations to suit each application, Sarcon cases provide flexible, box-shaped caps for semiconductor packages, thermistors and similar heat-generating components. Various standard sizes slip over the component to

Available in specific material formulations to suit each application, Sarcon cases provide flexible, box-shaped caps for semiconductor packages, thermistors and similar heat-generating components. Various standard sizes slip over the component to increase thermal transfer effectiveness to heat sinks and radiators.

Company: FUJIPOLY AMERICA CORP.

Product URL: Click here for more information

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

TTI Rail Transit Line Card

April 8, 2024
TTI stocks premier interconnect, passive and electromechanical components for rail systems as diverse as door control, HVAC and cabin entertainment, trackside safety, communications...

Littelfuse: Take Charge for Peak Performance in Material Handling Evs

April 8, 2024
As material handling electric vehicles such as automated guided vehicles (AGVs), autonomous mobile robots (AMRs) and forklifts become an integral part of Industry 4.0, Littelfuse...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!