A plastic-encapsulated package in the "hole-less" TO-247 outline features an electrically isolated mounting tab that dramatically simplifies power semiconductor device assembly. In the ISOPLUS247 package, the standard copper lead frame has been replaced by direct copper-bonded (DCB) alumina, to which any discrete semiconductors, from diodes to MOSFETs to thyristors, can be soldered.The package may be mounted directly onto a heat sink with no isolation interface material between the chip and mounting tab. The isolation voltage rating between the mounting tab and the chip is 2500 VRMS. Also, for a given chip area, the package is said to offer the industry's lowest isolated thermal resistance from junction to heat sink because the power dissipated in the chip flows to the heat sink through only one non-soldered interface. First devices in the package are HiPerFET MOSFETs ranging from 70V/180A to 500V/55A types.
Company: IXYS CORP.
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