Portable and handheld products that require extended battery life will benefit from the introduction of a new link layer device. The TSB12LV26 chip consumes one-third the power of previous generation parts and reduces costs by 30%. By utilizing the firm’s most advanced processes for 1394 solutions and innovating with new features in link and physical layer device design, the new chip enables designers to scale the number of ports with flexible and adaptable solutions in the PC, consumer electronics and peripherals markets. TSB12LV26 chip features deep FIFO memory with the firm’s dynamic threshold architecture, which assures high 1394 performance in PC and storage applications. The device seamlessly interfaces to all of the company’s one-, two-, three-, four- and six-port physical layer devices.
Company: TEXAS INSTRUMENTS INC. - Semiconductor Group, Literature Response Center
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