EE Product News

New Packaging Ups Power Handling Of SO8 Devices

Promising greater power handling by 50% for SO8 devices, the loss free package (LFPAK) offers a package resistance down to 0.8 m_, comparable to that of larger devices. This new approach also claims lower package inductance in the range of 1.1 nH as compared to 2 nH typical. Another advantage is a package height of 1.10 mm as opposed to 1.8 mm for a typical SO8. The first devices in a SOT669 (LFPAK) package are PH3230 and PH5330 n-channel enhancement-mode FETs. Both are available now nd cost $1.90 and $1.10, respectively, each/100. PHILIPS SEMICONDUCTORS INC., Sunnyvale, CA. (800) 234-7381.


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