EE Product News

QSFP Assemblies Include Low-Profile Copper Cable

A low-profile QSFP direct-attach copper cable assembly from Gore is “fiber-like” in size to fit QDR InfiniBand and 40-GbE aggregate applications. The low-profile copper cable fulfills the needs of dense, higher-port-count switch installations while providing a reliable interconnect for high-performance computing (HPC). This cable was provided to major switch vendors and computing OEMs for testing over the last eight months and was tested for compliance and interoperability in spring 2009. Gore developed its low-profile copper cable for QSFP assemblies and InfiniBand QDR applications. With a diameter of 0.170 inches for a 4x channel, 8-pair cable, the cross-section savings is 37% compared to alternative Gore cables and 58% compared to typical industry offerings. The reduced bend radius and smaller diameter allows for more aggressive routing as well as cleaner dressing of the cables in HPC environments. This cable is also less prone to interfere with the closing of cabinet doors in dense environments. W. L. GORE & ASSOCIATES INC., Landenberg, PA. (800) 311-3060.


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