Test Sockets Accommodate Fine Pitch CSP And BGA Devices

Designed for high frequency CSP and BGA devices with pitches from 0.5 mm through 1.27 mm, these RF test sockets employ a spring probe contact that ensures more than 500,000 insertion/withdrawal cycles. The extensive life cycle reportedly neither affects contact force nor increases contact resistance. The sockets provide a signal path measuring 2.49 mm for 1- and 1.27-mm pitch devices. Self inductance is 0.62 nH and contact resistance is 30 m½ after 500,000 cycles. Other features include a propagation delay of 45 ps, capacitance of 0.45 pF, and a contact force of 30g at an operating position of 0.98". Pricing for a 289-position BGA is $2,553 each/four. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.