EE Product News

Test Sockets Accommodate Fine Pitch CSP And BGA Devices

product pic

Designed for high frequency CSP and BGA devices with pitches from 0.5 mm through 1.27 mm, these RF test sockets employ a spring probe contact that ensures more than 500,000 insertion/withdrawal cycles. The extensive life cycle reportedly neither affects contact force nor increases contact resistance. The sockets provide a signal path measuring 2.49 mm for 1- and 1.27-mm pitch devices. Self inductance is 0.62 nH and contact resistance is 30 m½ after 500,000 cycles. Other features include a propagation delay of 45 ps, capacitance of 0.45 pF, and a contact force of 30g at an operating position of 0.98". Pricing for a 289-position BGA is $2,553 each/four. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish