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Design And Test Challenges Of 800V Powertrain Architecture For Electric Vehicle

An Electronic Design-hosted webinar sponsored by Tektronix

Originally broadcast on July 20, 2023. Now available On Demand.

Sponsor: Tektronix

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The rise in the adoption of EVs is leading to new test challenges to optimize the designs, reduce costs, and make the vehicles more efficient. The various power converters and traction inverters form the heart of the EV Powertrain subsystem and are one of the critical blocks that need to be tested to achieve the highest efficiency. Wide Bandgap technology like SiC/GaN are positively supporting these efforts, but at the same time have their own test challenges that need to be addressed. Join this session to understand the design and test challenges associated with 800V powertrain architecture for Electric Vehicle. 


Denis Solomon | Automotive Market Segment Manager | Tektronix 

Denis Solomon is automotive market segment manager at Tektronix. He is responsible for automotive business across Tektronix & Keithley portfolios. Prior to joining Tektronix, Denis has served in engineering, sales, and product management roles at global technology companies across three continents. He holds a bachelor's degree in computer engineering from the University of Rajasthan and an MBA from the University of California. 

Question and Answers

Srikrishna.N.H | Principal Engineer | Tektronix

Srikrishna is working with Tektronix as a Principal Engineer. His focus is on Power portfolio solutions and related technologies. He is passionate about understanding and solving customer challenges with a heavy focus on power applications like Power converter designs, Power Integrity, Inverter motor drives and Wide bandgap technologies. He has been associated with T&M industry for 20+ years and has wide expertise in Power domain. He has previously worked on High-speed serial compliance solutions for USB, Serial ATA, SAS, DDR, and MHL technologies. He has been associated with standard bodies like USB-IF, SATA-IO and JEDEC. Srikrishna has got several patents granted for his work. He has a Bachelor’s degree in Telecommunication engineering from Bangalore University and Master’s degree in Telecommunication and SW engineering from Illinois institute of Technology, Chicago.

Yogesh Pai | Senior Product Manager | Tektronix

Yogesh Pai is a Senior Product manager, Power Probes at Tektronix. Yogesh is passionate about understanding and solving customer challenges with a more recent focus on power applications like inverter motor drives and wide bandgap technology. He’s been associated with T&M industry for over 13 years and brings over a decade of experience from his previous role as an automation expert to product planning and management. Previously, he was working on High-speed serial compliance applications like HDMI, USB, Ethernet and MIPI technologies and has represented Tektronix at various standards bodies like HDMI Forum, MIPI Alliance and USB-IF. Yogesh has a Bachelor’s degree in Electronics and Communication Engineering and currently pursuing his MBA from Liverpool Business School.

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