Applied Materials, the world's largest seller of chip production equipment, said that its profits had slumped more than 40% over the last quarter as the Santa Clara, California-based company feels the pain from a prolonged slowdown in the...
The computer-on-module industry is about to launch another product lifecycle that will create a new performance class after ETX/XTX and COM Express. Say hello to COM-HPC.
Fast removable storage gets a leg up with the XFMEXPRESS standard, which is based on NVMe.
The SEooC model provides an ideal approach for developing high-quality software elements out of context. Using the methods defined in ISO 26262, these elements offer a specific functionality and meet a required safety level for automotive...
Putting together the HoverGames quadcopter is just the beginning—even a five-year-old can help you build it.
SoC architects facing the difficulty of supporting various serial memories can design a high-frequency memory controller for multiple memories using source-synchronous memory.
AMD named a new executive vice president to lead its computing, graphics and semi-custom businesses as the Santa Clara, California-based company aims to swipe more market share from Intel and Nvidia with its Ryzen CPUs and Radeon GPUs. Rick...
Future 5G implementations will require many development platforms for experimentation. Using a COTS system as a starting point will accelerate time to market.
Check out the latest embedded-system product solutions, from an XMC card integrating a Kintex UltraScale FPGA to a "1z-nm" DDR memory.
Software must be parallelized and modified to benefit from new approaches to enhance hardware performance in today’s automotive designs. AUTOSAR’s layered software architecture leverages MCUs to meet the latest demands.