Interconnects

Answering the call for ever-smaller connectors with increased contact density, LEMO extended its M series of plugs and cable-mount sockets with the ultra-compact MM connectors. The MM connectors come with three or four contacts, and feature the...

With a mated height of 1.9 mm and a design for maximum printed-circuit-board (PCB) flexibility, JST Corp.’s ADH series of wire-to-board, crimp-style, disconnectable connectors will find homes in a multitude of high-density LED light...

Adapting the standard 3.5-mm audio jack found on most iOS or Android smartphones, the Smartphone Quick-Jack Solution creates a universal interface for external sensors, switches, peripherals, and other devices. Simply, NXP’s kit turns the...

The LEH series wire-to-board, crimp-style disconnectable connector comes in subminiature size: 1.8-mm (0.071-in.) pitch and side entry mating height of 3.0 mm (0.118 in.). Developed by JST Corp. for LED light applications, particularly with low...

Molex’s IllumiMate 1.00mm- and 1.25mm-pitch wire-to-board system provides an array of mating styles, voltage ratings, circuit sizes, and locking types for today’s flat-panel LED television and PC monitors—in a single connector...

Power and data can now transmit through one optical connector. Fischer Connectors developed what it calls a hybrid connector, the latest addition to its FiberOptic Series. The new FOH 2-2 push-pull connector incorporates two fiber channels and two...

Flexible and customizable shielded electrical conduit system designed specifically to be used in ground support test equipment cables for rugged environments within the aerospace industry.

Featuring a mated height of 2.50 mm, FCI’s low-profile, 1.2-mm-pitch, wire-to-board connector addresses demands for miniaturized interconnect solutions. An enclosed receptacle profile with lead-in features assist mating in tight spaces. The...

The AUH Series of wire-to-board, crimp-style, disconnectable connectors, featuring a mated height of 1.85 mm, offer greater flexibility and reliability for high-density applications, says developer JST Corp. The polarized, side-entry (right angle)...

Ironwood Electronics’ Giga-snaP BGA socket adapter pair allows 0.5-mm-pitch, 11.5- by 13-mm, 14x14 array e-MMC modules housed in 153-ball BGAs to be socketed and subsequently operated without compromising performance in memory applications...