System-in-package (SiP) technologies are making a significant impact on the electronics supply chain as the semiconductor industry strives to meet the perpetual demand for higher performance, smaller size, and lower cost. SiPs contain two or more dissimilar dies typically combined with other components such as passives, filters, MEMS, sensors, and antennas, according to E. Jan Vardaman in TechSearch International’s “SiP Drivers and Market Trends” presentation at the International Microelectronics Assembly and Packaging Society’s SiP 2017 conference.
- Packaging technologies combine separate dies into a single chip
- Test and validation approaches must evolve to ensure quality
- Modular solutions allow test organizations to adapt to future needs