Originally Broadcast: Wednesday, July 24, 2019
Sponsor: Texas Instruments
Duration: 30 Minutes
As industry expectations for automation and measurement accuracy increase, more applications are benefitting from 3D machine vision techniques over simpler 2D measurement systems to enable reliable decision-making. For example, inline automated optical inspection (AOI) can identify defective parts in a production line so they can be routed for rework or scrapped earlier, saving time and money and increasing product quality. Introducing z-dimension data enables fewer false fails and can measure geometries not captured by 2D systems. Other example 3D machine vision applications include factory automation use cases such as pick-and-place systems or robotic arms, inline metrology, solder paste inspection, and biometrics.
Structured light is one of the top 3D machine vision techniques that combines a light pattern generator with an optical sensor such as a camera. DLP technology is used in structured light systems to provide fast, flexible and highly programmable light patterns, resulting in 3D measurements with millimeter or even micron-level accuracy. This webinar will cover system considerations as well as TI DLP® Products for structured light solutions.
- Benefits of structured light for 3D machine vision
- Selecting camera & projection solutions
- Camera frame rate / projector pattern rate
- Choosing binary or grayscale light patterns, including
- How to create binary and grayscale patterns
- Development paths with TI DLP® Products
- Evaluation modules and compatible optical engines
Ben Lee, Industrial Applications Engineer, Texas Instruments
Ben Lee is a senior Applications Engineer with 20 years of experience at Texas Instruments and currently supports TI DLP® Products. During his time at Texas Instruments, his outstanding technical support has enabled DLP technology to enter industrial light control applications such as direct imaging lithography, 3D printing, 3D machine vision, medical imaging, optical networking, and microscopy.
In his Applications role, Ben is also responsible for product technical documentation and training materials as well as system validation support for DLP chipsets. Ben is also a co-chair for the Emerging Digital Micromirror Device Based Systems and Applications technical conference held each year at SPIE Photonics West. Prior to joining TI, Ben worked in the Information Technology industry. Ben holds Bachelor of Science and Master of Science degrees in Physics from the University of Texas at Dallas.