Available On-Demand Now!
Originally Broadcast: Thursday, June 27, 2019
Event Type: Live Webinar
Duration: 1 Hour
The impact of increasingly powerful electronics on our society cannot be overstated. These more powerful electronic systems produce significant heat that must be dissipated to prevent premature component failure. Engineers that design electronics face a significant thermal management challenge. This task becomes even more challenging when the cooling system relies on natural convection instead of forced convection from fans due to the relatively short life expectancy of fans.
Engineers can use multiphysics simulation software to improve the accuracy of their calculations in comparison to analytic and single-physics solutions. These simulations include heat generated by the component, airflow around the component, and radiative heat transfer from the component. Heat generation due to resistive heating in the board can be included with heat generated from components to determine the heat generated within the system. Airflow through the system due to either forced or natural convection can also be analyzed. For many systems, radiation must be considered for accurate temperature predictions due to the large amount of heat transfer that occurs via this mechanism in many electronics cooling problems.
In this presentation, Kyle Koppenhoefer from AltaSim Technologies will discuss the analysis of an electronics cooling problem subjected to a complex thermal environment. The webinar will also include a live demo in the COMSOL Multiphysics® software and a Q&A session.
Kyle Koppenhoefer, Principal, AltaSim Technologies
Kyle Koppenhoefer has been one of the principals and leaders at AltaSim Technologies for 15 years. He works with customers to identify how computational analysis can be used to further develop their products and manufacturing processes. Prior to cofounding AltaSim, Kyle worked for the Department of Defense and the Edison Welding Institute. He holds a PhD in civil engineering from the University of Illinois.
Siva Sashank Tholeti, Applications Engineer, COMSOL
Siva Sashank Tholeti is an applications engineer at COMSOL. He received his PhD in aeronautics and astronautics from Purdue University. His areas of interest include CFD, plasma-enhanced aerodynamics, plasma physics, propulsion, and multiphysics problems.
Joshua Thomas, Engineer, AltaSim Technologies
Joshua Thomas has provided consulting and training support in COMSOL Multiphysics® over the last six years as a research engineer at AltaSim Technologies. He is a lead instructor in many of AltaSim’s classes and has worked extensively with structural mechanics problems and multiphysics problems that include structural mechanics. Josh received his bachelor’s and master’s degrees in mechanical engineering from Ohio State University.