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Original Broadcast Date: June 5, 2025
Duration: 1 Hour
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As society increasingly relies on electronics, the demand for powerful devices that are safe and reliable increases as well. These complex electronics generate considerable heat that must be efficiently dissipated to prevent premature component failure. Electronics that experience cyclical variations in temperature may fail due to fatigue cracking initiated and propagated by thermomechanical strains, creating a challenge for thermal management design engineers.
During the electronics design process, engineers can use multiphysics simulation software to effectively account for the thermal and mechanical response of electrical components. Large strains are produced by mechanical restraints to thermal expansion and contraction, as well as by thermal gradients within the electronics. The heating and cooling of components over time produces a time-varying thermomechanical strain in the electronics. Solder joints, for instance, are highly susceptible to this type of thermomechanical fatigue.
In this webinar, guest speakers Kyle Koppenhoefer and Joshua Thomas from AltaSim Technologies will demonstrate how multiphysics simulation can be used to predict thermomechanical fatigue in electronic devices. The webinar will feature a live demonstration of the COMSOL Multiphysics® software and include a Q&A session.
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