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Speeding Up the Widespread Adoption of Wireless EV Charging

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Maximize Flexibility in SoC Design with eFPGAs

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Engineering on Friday

Inside the Macroworld of National Geographic’s “A Real Bug’s Life 2”

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Cost-Efficient 10/20-A Bridge Driver ICs Built for Automotive Apps

Featured

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Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Recommended

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Join Me at the 2025 Chiplet Summit

Check out the 2025 Chiplet Summit to be held from January 21-23 at the Santa Clara Convention Center.

Members Only Content

Download PDF - Electronic Design Nov.-Dec. 2024

Download the digital version of the November-December edition of Electronic Design.

Editor's Choice

CES 2025 Las Vegas Convention Center

CES 2025: Behind the Scenes

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Basics of Design: How to Solder and Repair Circuit Boards

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How Carbon Nanotubes Can Transform the Semiconductor Industry

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Why Purpose-Built Drives are a Must for Industrial Devices

SEARCH FOR DATA SHEETS, PRICE, STOCK, AND PART STATUS OF ELECTRONIC COMPONENTS

Industry Insights

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Additive Manufactured Electronics: Disrupting the Electronics Industry

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Adapting to UN Regulation 155: Automotive Cybersecurity Solutions

Blackberry QNX’s OS Safety and Security Survey Results

Security and Safety Top the List of OS Selection Criteria

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The Difference Between Autonomous Cars and Autonomous Mobile Robots @ mwrf.com

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Industry Insights

Freelance Engineering 101: The Power, Job Market, and Money

Technology Advancements

Projecting Images into the Eye of the Beholder

Projecting Images into the Eye of the Beholder

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Pulsed RF Power for Angstrom-Scale Processes

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Self-Powering Electric-Field Skin Patch Speeds Wound Healing

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Enhance Power-Delivery Networks with High-Bandwidth IVRs

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Vehicle Tech at CES 2025: From SDVs to Windshield Widgets

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Bringing AI Acceleration to Arduino

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CES 2025: Kubota Integrates Autonomy, Robotics @ ConstructionEquipment.com

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Deere Unveils Autonomous Articulated Dump Truck @ ConstructionEquipment.com

Products and Solutions

SMU Tests Nanoscale & 2D Semiconductor Devices

Test & Measurement

SMU Tests Nanoscale and 2D Semiconductor Devices

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Power Protection

Demonstrating an Intrinsically Safe Advanced PHY Device

Addressing the Electronic Component Supply Chain

Computer-Aided Design

Streamlining the Electronic Component Supply Chain

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Sponsored Content

Learning Resources

“Auxless” GaN Flyback Converters Tackle AC-DC Adapter Design Challenges

Automotive

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New Tech for Smaller, Cooler, Faster Chips Plus Power Products Aplenty

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CES 2025: Honda Zeroes in on Two New EV Models and Renesas Partnership

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Precision Shunt-Monitor ICs Meet Automotive Current-Sensing Challenge

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Fixed-Direction Voltage Level Translators Cut Power Consumption and Pin Count

Featured Media

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Inside Electronics

How to Develop a Product in Today’s Electronics Ecosystem

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Inside Electronics

Not All RISC-V IP is the Same

MIPS P8700 RISC-V Cores Target Automotive Applications

Multicore RISC-V Designs for Smart Automotive Apps

Smart home

Inside Electronics

Empowering Smart-Home Devices with Low-Light Energy Harvesting

Chiplets Extend Automotive SoC AI and GPU Capability

Microprocessors

Chiplets Extend Automotive SoC AI and GPU Capability

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Inside Electronics

How to Handle the Increasing Data Demands on Server-Farm Cabling

Analog

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So...The CMOS Circuits in Our Texts Go Back to 1963?

Radioisotope thermoelectric generator of the Curiosity rover

How to Build a $15k Electric Car—Think in a Bigger Box, Not Outside One

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For Designers: Logic Nets in Transistor Cans (ED article from 1961)

Embedded

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Software Tools Refine Antenna Selection @ mwrf.com

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PWM Controller Tailored for AI Server and Graphics Cards Based on Blackwell GPUs

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Production-Grade AI Arrives in EDA for Analog Design and Verification

Automation

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Sponsored Content

Learning Resources

Low-Power 60-GHz Radar Sensors Bring High Accuracy to Multiple Applications

Renesas IO-Link IC support

IO-Link Adds 4-Channel Master and Signal-Conditioning IC Support

IO-Link transceiver for the factory floor

Startup Launches IO-Link Transceiver to Connect the Factory Floors of the Future

Empowering Smart-Home Applications with Advanced Connectivity

Advanced Connectivity Enriches Smart-Home Apps

Power

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NASA’s Strategy to Lower EMI in Outer Space

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Clarios supercapacitors help boost mobility’s next phase @ FleetOwner.com

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Battery Packaging Architectures: Materials Considerations

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Standard-Threshold 40-V MOSFETs Enhance Immunity, Design Flexibility

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Configurable Three-Output PMIC Steers Toward Automotive MCUs

Graphene=based interconnect technology

Graphene-Based Interconnects Could Improve Density of Digital, Analog, and Power ICs

Communications

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IoT SoCs Feature Multi-Protocol Connectivity, Enhanced Security @ mwrf.com

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Tailoring the Design of Transimpedance Amplifiers to Infrared Sensor Apps (Part 2)

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Cadence Rolls Out System Chiplet to Reorganize the SoC

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Industry Insights

Salaries Trend Up for Electrical and Electronics Engineers in 2024

Test & Measurement

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Thermal Imaging Helps Automakers Meet 2029 Nighttime AEB Safety Standards

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Radar-Focused Voltage-Controlled SAW Oscillators Feature Ultra-Low Phase Noise

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Engineering on Friday

A Holiday Gift Guide that Will Change Your Life

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Test & Measurement

How Much Power is Needed to Charge My Battery Cell?

NOVOSENSE automotive-grade current sensors

Test & Measurement

Automotive-Grade Current Sensors Eliminate Need for Isolation Components

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Test & Measurement

The Latest in Current-Sensing Products: 2024