Georgia Institute of Technology
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Following a strategic approach to cooling, power delivery and rack-level integration will help data centers boost AI compute density.
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Driving Innovation in 3d IC Chiplet Summit
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Arm
Tensor and Arm partner to deliver AI-defined compute foundation for personal robocar.
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Editor's Choice

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Software-defined vehicles (SDVs) are built around real-time networking.
March 3, 2026
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Check out the latest stories, videos, and podcasts from the week of Mar. 2, 2026.
March 3, 2026
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Members Only
Download this eBook on time-sensitive networking, which is becoming an essential element in numerous applications from automotive to industrial.
March 2, 2026
Google Gemini
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Check out the breaking news, videos, and podcasts at this year's DesignCon show.
Feb. 25, 2026

Learning Resources

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Geopolitical shocks, shifting trade alliances and volatile tariffs are reshaping global supply chains. Join our webinar to learn how leaders are redesigning networks, diversifying...
March 31, 2026
Texas Instruments
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Sponsored by Texas Instruments: Wide-bandgap materials and advanced embedded processing are being leveraged to enhance the efficiency, power density, and reliability in renewable...
Feb. 27, 2026
Texas Instruments
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Sponsored by Texas Instruments: Rapid growth in server power consumption necessitates an effective grid-to-gate strategy.
Feb. 24, 2026
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Unlock next‑gen modular connector design! Join our webinar to explore rugged, high‑density solutions with hyperboloid reliability, new Cat5e/Cat6A data modules, and an intuitive...
April 14, 2026

Featured Media

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Tektronix’s 7 Series oscilloscope becomes a powerful signal-integrity tool where signal conditioning and integrity analysis can be easily performed on an advanced GUI.
Feb. 26, 2026
GaN Power Devices for Driving Humanoid Robot Motor Joints
Texas Instruments is developing GaN power devices to enable more compact and efficient motor joints for humanoid robots.
Feb. 26, 2026
Motor Control ICs Boost Performance of BLDCs
At CES, MPS highlighted how its motor-control ICs can enable smarter, more precise control of brushless DC motors that are multiplying across robotics and other industries.
Feb. 20, 2026
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The phase-shifted multiphase boost converter, which delivers higher efficiencies at high loads, offers a potentially better option to meet requirements for higher voltages.
Feb. 19, 2026

Inside Electronics Podcast

Technology Advancements

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Inside Electronics
Find out how to do AI processing of multiple video streams locally.
March 3, 2026
The Ohio State University
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There may be a fungus on your future bill of materials if mushroom-based memristors become a viable memory element.
March 2, 2026
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Flash memory is evolving fast. As demands for speed, scalability, and efficiency rise, the industry standard is shifting from eMMC to UFS.
Feb. 26, 2026
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Editor Bill Wong’s observations from the recent 2026 Chiplet Summit.
Feb. 25, 2026

Products and Solutions

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The magnetic current sensor from Allegro Microsystems is intended for high-voltage power converters prevalent in EVs and beyond.
March 3, 2026
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High-voltage buck controllers, which offer the beauty of a design without the cost and difficulty of using a transformer, enhance power-conversion efficiency and enable high output...
Feb. 24, 2026
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New high-side and galvanically isolated gate drivers from STMicroelectronics bring advanced reliability and protective features to automotive systems.
Feb. 20, 2026
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As worldwide markets for electric vehicles continue to gain market share, low-cost connections of vehicles to mains charging need to be safe and efficient.
Feb. 18, 2026

Industry Insights

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Take a magical look at misdirection, deception, Iran, Ukraine, and more.
March 2, 2026
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The U.S. Supreme Court's recent ruling on a core element of President Trump's tariff strategies has opened the door for thousands of businesses to file for refunds.
Feb. 25, 2026
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Andy finds himself in the quandary of needing to cover DesignCon in the Bay Area and to cover Engineers Week and thus is forced to resort to desperate measures...AI.
Feb. 25, 2026
ID 78081816 | Maksym Filipchuk | Dreamstime.com
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The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as key enablers of future designs.
Feb. 24, 2026