Highlights

44mythspromo
EDA

44 Myths About Chip Verification eBook (Download)

Many misconceptions have emerged about chip simulation and verification tools and techniques. Download this eBook, which collects together four of our most popular 11 Myths articles...
Siemens
EDA

The Hard Facts on Hardware-Assisted Verification

Learn more about present and future of hardware-assisted verification—namely emulation and prototyping—which is becoming critical to creating the next generation of IC designs...
Andreyi Armiagov, Dreamstime
EDA

A New Way to Uncover Hidden Vulnerabilities in Hardware

Amida debuted a new software tool that addresses the Achilles’ heels of modern electronics: security.
99100595 © Scanrail | Dreamstime.com
alt.embedded

Revitalizing U.S. Semiconductor Manufacturing

The CHIPS Act is changing semiconductor manufacturing in the United States. What are foundries and fabless firms contending with to get the ball rolling?
Siemens
EDA

Siemens Helps Understand Heat Inside 3D Chip Designs—and Out

The company rolled out Calibre 3D Thermal to help deliver fast and accurate die-level thermal analysis of 3D IC designs.
Ansys
EDA

Ansys Adds Another Dimension to the 3D Chip Design Process

Learn how Ansys leverages NVIDIA’s Omniverse to unlock the future of 2.5D and 3D multi-die systems.
EnSilica
EDA

Select the Right Microcontroller IP for Your High-Integrity SoCs

There may be a seemingly unlimited array of microcontrollers for consideration, but how do you select the right one when developing high-integrity SoCs that meet all functional...
University of Washington (Seattle)
Printed Circuit Boards

Look Out, FR-4: Recyclable PCBs May be Coming After You

Standard printed-circuit-board material is technically excellent but non-recyclable. A new material may change that limitation.
Viasion
Printed Circuit Boards

5 Practical Strategies to Address PCB Miniaturization Challenges

Tackling the top five PCB design challenges requires pragmatic strategies to handle smaller components on advanced boards.
Heterogeneous 2
EDA

Heterogeneous 2.5/3D Chip Design Requires Integrated Tools

Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.