Highlights

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Many misconceptions have emerged about chip simulation and verification tools and techniques. Download this eBook, which collects together four of our most popular 11 Myths articles...
Mick Posner talks about the importance of UCIe
Synopsys’ Mick Posner talks about the Universal Chiplet Interconnect Express and its importance in today’s designs.
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The Ceva-XC23 DSP core has two independent execution threads and a dynamic scheduled vector-processor.
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As SoCs grow in complexity, manual NoC generation is no longer practical. This article highlights how automated NoC generation streamlines interconnect development to improve ...
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Integrated development environments aren’t just a passing trend—they’ve become essential toolboxes in the designer’s arsenal. Still, some myths have emerged that need to be debunked...
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Trends in 2025 Chiplet Design
Find out how chip packaging and chiplets will deliver more AI acceleration in the data center.
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There’s been a significant shift toward RISC-V architectures in SoC design. This article highlights its impact on the semiconductor industry and role in fostering innovation and...
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Chiplets, artificial intelligence, and advanced packaging push foundry capacity.
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Given the complex relationship between geopolitical factors and cyberthreats in the semiconductor industry, what can companies do to protect the IP that’s the source of their ...
AI Chip Development with 3D Multi-Die Designs
Synopsys' Abhijeet Chakraborty’s Chiplet Summit keynote focused on multi-die designs.