UCIe: Open Chiplet Ecosystem at the Package Level

July 31, 2025

The UCIe Consortium’s Brian Rea gives a short overview of the Universal Chiplet Interconnect Express.

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The Universal Chiplet Interconnect Express (UCIe) is an open chiplet standard for implementing a high-bandwidth, low-latency interconnect between chiplets. It’s managed by the UCIe Consortium.

The video (see above) provides a short introduction to UCIe by Brian Rea, Marketing WorkGroup Chair at the UCIe Consortium.

UCIe can be used in a number of different package options (see figure). The latest standard is UCIe 2.0. It’s fully backwards compatible and adds new features like the optional UCIe DFx Architecture (UDA). UDA supports a management fabric connecting chiplets to enhance testing, telemetry, and debugging that’s vendor-agnostic.

UCIe can be utilized with different interposer and chiplet connectivity options — UCIe can be utilized with the different interposer and chiplet connectivity options available to developers.

UCIe In Action

UCIe is just getting started, but companies like Cadence have demonstrated UCIe in action:

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About the Author

William G. Wong | Senior Content Director - Electronic Design and Microwaves & RF

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