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  • Chiplets – Electronic Design Automation Insights

    • Chiplets – Electronic Design Automation Insights

    Mixing dies, interposers and designs to fabricate new solutions
    Chiplets – Electronic Design Automation Insights cover image
    Chiplets – Electronic Design Automation Insights
    Digital
    Archives
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    EDA

    Through the Substrate Looking Glass

    Oct. 19, 2023
    Intel is looking to use glass, which has strong thermal and mechanical characteristics, as a substrate for chiplets.
    Synopsys
    Promo Multi Die Synopsiys Web
    EDA

    Multi-Die Systems Reshape Semiconductor Innovation

    Oct. 3, 2023
    Explore the main driving forces behind today’s multi-die systems, how they’re becoming the choice system architecture, and how they’re catalyzing the next wave of semiconductor...
    AMD
    Amd Versal Promo
    Embedded

    Massive Chiplet-Based FPGA Designed to Make More Chips

    July 7, 2023
    The Versal Premium adaptive System-on-Chip (SoC) targets EDA simulation and verification applications.
    Marian_Mocanu_Dreamstime
    Promo Marian Mocanu Dreamstime
    FPGA

    Chiplet-Based FPGA Tackles CXL

    May 24, 2023
    Intel’s Agilex 7 with R-Tile support works with PCIe 5.0 and CXL.
    Ed Promo 4
    Articles

    TechXchange: Chiplets – Electronic Design Automation Insights

    May 22, 2023
    Chiplets provide a way to reuse proven dies using interposers that work like a printed circuit board except at the chip level.

    More content from Chiplets – Electronic Design Automation Insights

    AMD
    3 D Hybrid Bonding
    Automation

    Chiplet Technology Helps Integrate Advanced Computing Platforms

    June 21, 2022
    AMD will utilize a range of 2.5D and 3D chiplets to integrate systems that will include the company's FPGA technology.
    zGlue
    Ucie Promo
    Embedded

    Building a Chiplet Ecosystem

    March 10, 2022
    The recently announced Universal Chiplet Interconnect Express standard, based on PCIe and CXL, will help simplify chip design.
    Chip Packaging Promo Image4 1798 X 895
    Articles

    TechXchange: Chip Packaging

    March 7, 2021
    Packaging: The new dimension of advancement in the semiconductor industry.
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    Webinars

    Chiplets – Electronic Design Automation Insights

    Feb. 24, 2021
    Mixing dies, interposers and designs to fabricate new solutions. Log in to view the on-demand webinar panel session and Q&A session.
    Ed Promo 3
    Members Only

    Members-Only Webinar

    Feb. 15, 2021
    Chiplets – Electronic Design Automation Insights
    zGlue
    Ces Z Glue Promo
    Automation

    Building Custom Chips Just Got Easier

    Jan. 6, 2020
    zGlue’s ChipBuilder Pro lets designers create chips using its 2.5D chiplet Smart Fabric.
    Tsmc Arm Chiplets Promo
    Embedded

    TSMC Works With Arm to Chart Future of Chiplets

    Oct. 9, 2019
    TSMC Works With Arm to Chart Future of Chiplets
    (Image courtesy of Intel).
    Automation

    Intel Adds New Technology to Advanced Packaging Arsenal

    July 16, 2019
    Intel Adds New Technology to Advanced Packaging Arsenal
    (Image courtesy of Intel).
    Embedded

    Intel Introduces New Way to Stack Chips on Top of Each Other

    Dec. 14, 2018
    Intel Introduces New Way to Stack Chips on Top of Each Other
    Electronicdesign 17576 Zglue Promo 0
    Automation

    zGlue Fabric Reduces Size of Wearable Tech

    Aug. 21, 2017
    This silicon interposer fabric lets developers integrate multiple die into a single, compact chip. It is ideal for compact form factors needed for applications like wearable devices...
    Electronic Design
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