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  • Chiplets – Electronic Design Automation Insights

    Mixing dies, interposers and designs to fabricate new solutions

    UMI Scales the Memory Wall in the Chiplet/Multi-Die Era

    April 22, 2024
    Discover how the Universal Memory Interface tackles substrate- and die-level real-estate challenges in chiplet-based design, unlocking performance and scalability.

    Inside Intel’s Gaudi 3 Chip for AI Training and Inference

    April 11, 2024
    The company’s next-gen AI silicon adds more accelerator cores, faster networking, and extra high-bandwidth memory.
    Andrei Dzemidzenka, Dreamstime

    Does This Chip Hold the Future of the Semiconductor Industry?

    April 3, 2024
    Learn more about Pike Creek and its potential implications as the first test chip featuring chiplets linked by the UCIe standard.
    How Chiplets Accelerate Generative AI Applications
    Machine Learning

    How Can Chiplets Accelerate Generative AI Applications?

    March 27, 2024
    This superpanel explores the role of chiplets in advancing ever-expanding generative AI technology.
    86230086 © Flynt | Dreamstime.com

    Packaging Chiplets for Performance and Profit

    March 20, 2024
    When it comes to chiplets, it’s all about packaging technology.

    More content from Chiplets – Electronic Design Automation Insights

    What will Chiplets Look Like in 2029?

    Chiplets in 2029: How We Get There

    March 11, 2024
    Wrapping up the 2024 Chiplet Summit, this panel session discussed the huge advantages and persistent challenges presented by chiplets.
    Multi-Die Systems Set the Stage for Innovation

    Multi-Die Systems Set the Stage for Innovation

    Feb. 21, 2024
    Abhijeet Chakraborty, Vice President of Engineering at Synopsys, in his keynote at the 2024 Chiplet Summit, said that last year was an inflection point for multi-die systems.
    91824901 © Forance | Dreamstime.com

    EDA Helps Cultivate the Future of Die-to-Die Connectivity

    Feb. 8, 2024
    Explore Keysight’s Chiplet PHY Designer tool and the game-changing UCIe standard in chip design.

    Join Me at This Year’s Chiplet Summit

    Jan. 22, 2024
    The Chiplet Summit is coming up at the beginning of February. I hope to meet up with you there.

    Data-Center CPU’s Dual-Chiplet Design is Intent on AI

    Dec. 14, 2023
    Intel’s latest data-center CPU is a prelude to the process and packaging innovations it has in store for 2024.
    Can Chiplets Solve Semiconductor Challenges?

    Can Chiplets Solve Semiconductor Challenges?

    Dec. 13, 2023
    With the right investments, chiplets can help solve long-standing industry challenges such as increasing costs and supply disruptions, resulting in a world where devices are more...
    17001699 © Toniflap | Dreamstime.com
    Oa Dreamstime L 17001699

    7 Technologies that Will Change Everything

    Nov. 2, 2023
    Jim Handy’s crystal ball reveals trends about many topics, ranging from memory chips to generative AI.
    Maxresdefault 65303d64c15e8

    Through the Substrate Looking Glass

    Oct. 19, 2023
    Intel is looking to use glass, which has strong thermal and mechanical characteristics, as a substrate for chiplets.
    Promo Multi Die Synopsiys Web

    Multi-Die Systems Reshape Semiconductor Innovation

    Oct. 3, 2023
    Explore the main driving forces behind today’s multi-die systems, how they’re becoming the choice system architecture, and how they’re catalyzing the next wave of semiconductor...
    Amd Versal Promo

    Massive Chiplet-Based FPGA Designed to Make More Chips

    July 7, 2023
    The Versal Premium adaptive System-on-Chip (SoC) targets EDA simulation and verification applications.
    Promo Marian Mocanu Dreamstime

    Chiplet-Based FPGA Tackles CXL

    May 24, 2023
    Intel’s Agilex 7 with R-Tile support works with PCIe 5.0 and CXL.
    3 D Hybrid Bonding

    Chiplet Technology Helps Integrate Advanced Computing Platforms

    June 21, 2022
    AMD will utilize a range of 2.5D and 3D chiplets to integrate systems that will include the company's FPGA technology.
    Ucie Promo

    Building a Chiplet Ecosystem

    March 10, 2022
    The recently announced Universal Chiplet Interconnect Express standard, based on PCIe and CXL, will help simplify chip design.
    Chip Packaging Promo Image4 1798 X 895

    TechXchange: Chip Packaging

    March 7, 2021
    Packaging: The new dimension of advancement in the semiconductor industry.
    Ed Promo 3 6035686bb3ea8

    TechXchange: Chiplets – Electronic Design Automation Insights

    Feb. 24, 2021
    Mixing dies, interposers, and designs to fabricate new solutions. Log in to view the on-demand webinar panel session and Q&A session.
    Ed Promo 3
    Members Only

    Members-Only Webinar

    Feb. 15, 2021
    Chiplets – Electronic Design Automation Insights
    Ces Z Glue Promo

    Building Custom Chips Just Got Easier

    Jan. 6, 2020
    zGlue’s ChipBuilder Pro lets designers create chips using its 2.5D chiplet Smart Fabric.
    Tsmc Arm Chiplets Promo

    TSMC Works With Arm to Chart Future of Chiplets

    Oct. 9, 2019
    TSMC Works With Arm to Chart Future of Chiplets
    (Image courtesy of Intel).

    Intel Adds New Technology to Advanced Packaging Arsenal

    July 16, 2019
    Intel Adds New Technology to Advanced Packaging Arsenal
    (Image courtesy of Intel).

    Intel Introduces New Way to Stack Chips on Top of Each Other

    Dec. 14, 2018
    Intel Introduces New Way to Stack Chips on Top of Each Other
    Electronicdesign 17576 Zglue Promo 0

    zGlue Fabric Reduces Size of Wearable Tech

    Aug. 21, 2017
    This silicon interposer fabric lets developers integrate multiple die into a single, compact chip. It is ideal for compact form factors needed for applications like wearable devices...