Highlights

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TechXchange

All About Ada and SPARK Programming

Ada and SPARK are often used to develop applications that require high reliability and no bugs.
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Security

FCC Looks at Upgrading School Cybersecurity to Protect Against Hackers

The FCC is taking an interest in keeping schools and libraries safe from digital threats with the backing of government funding.
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Machine Learning

Bigger Might Not Be Better When It Comes to AI on the Edge

Right-sizing hardware to balance performance, power consumption, and cost enables machine learning to run on resource-constrained platforms.
Dreamstime
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Machine Learning

Generative AI at the Edge: Engineering Challenges

The increasing demands for generative AI at the edge call for new solutions that can achieve high performance within the low-power requirements for edge apps.
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Processors

TechXchange: RISC-V: The Instruction-Set Alternative

Check out our curated content related to RISC-V.
Texas Instruments
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Power

Can Advanced Packaging Break the Mold in Power Management?

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics.
Samsung: https://news.samsung.com/global/samsung-smart-forward-updates-to-elevate-functionality-future-proofing-and-safety-of-home-appliances
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Wolfspeed
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Power

2,300-V SiC Power Module Raises the Bar for Renewable Energy

Wolfspeed’s 2,300-V silicon-carbide (SiC) power modules sit at the heart of EPC Power’s utility-scale, string-style inverter for renewable-powered grids.
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Microcontrollers

Crossover Micro Sports AI Acceleration

NXP’s i.MX RT700 crossover microcontroller incorporates the eIQ Neutron neural processing unit.
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Initial Results from Electronic Design’s Maker Survey

Here are the latest results from Electronic Design’s Maker Survey that asks about the tools you use, product-inspired projects, and more.
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Inside Electronics

Overcoming Challenges in Advanced Logic Semiconductor Manufacturing

Henri Richard of Rapidus Design Solutions discusses the latest in logic-chip fabrication and his company’s solutions on this front.