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ID 340558606 - Ai © Yulia Gapeenko - Dreamstime.com
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ID 44446702 © Feverpitched | Dreamstime.com
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The new C-PHY v3.0 specification will foster next-generation imaging sensor innovation for everything from mobile devices to transportation.
ID 213740052 © Alexandr Hlopotov | Dreamstime.com
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Immersion cooling is changing the way engineers are addressing thermal issues in data centers.
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The Millennium M2000 supercomputer taps NVIDIA’s Blackwell GPUs to crush simulation workloads and redline the possibilities in design and engineering.
ID 118173325 © Funtap P | Dreamstime.com
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Phoenix Contact expanded its Ethernet lineup with rugged RJ45 magnetic jacks that simplify PCB design, reduce EMI, and deliver 1-Gb/s performance.
Tony Vitolo, Electronic Design
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Battery technology continues to play an increasingly influential role in the power universe, while venerable relays and IGBTs remain relevant in defense and automotive applications...
Robert Greenfield | Acromag
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Discover the details behind the new VITA 93 QMC mezzanine module standard that targets industrial and rugged applications.
ROHM Semiconductor
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ROHM’s new 1-kW, 905-nm, 1x8 laser array is aimed at LiDAR and ADAS applications. Andy also provides his EDitor’s Take on designing with this component.
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The automotive-grade resistors from Vishay offer high pulse absorption, power dissipation of 150 W, and a clip-mount package for direct mounting on a heatsink.
ID_316508515_alena_butusava, and Macronix
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NOR flash memory is evolving much in the same way as its cousin, NAND flash: 3D NOR is on the horizon and poised to boost memory densities and dramatically enhance designs.