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Advanced 1,600-V IGBTs Aimed at Energy-Conscious Appliance Markets

Aug. 4, 2025

ST’s new rugged IGBTs offer high efficiency, reliability, and low cost for induction heaters and cookers, microwave ovens, and other value-conscious applications.

Lee Goldberg

Related To:

Electronic Design

The STGWA30IH160DF2 IGBT developed by STMicroelectronics combines a breakdown-voltage rating of 1,600 V and high thermal performance with efficiency in soft-switching topologies, plus easy paralleling in high-power applications.

The IGBT, featuring a maximum junction temperature of 175°C and low thermal resistance to ensure efficient dissipation, has a current rating of 30 A. It offers long-term reliability in challenging environments while enabling a lower bill of materials (BOM). Thus, its especially suited for cost-conscious applications, including induction heaters and cookers, microwave ovens, and rice cookers.

Leveraging advanced trench-gate field-stop (TGFS) technology, the 1,600-V IGBT in ST’s new IH2-generation combines high breakdown-voltage capability with low saturation voltage (V_CE(sat)) to minimize conduction losses. As a result, the STGWA30IH160DF2 has a V_CE(sat) of just 1.77 V (typical), thus minimizing tail current that results in low turn-off energy.

In addition, the device’s anti-parallel diode has a low forward voltage and soft recovery that enhance efficiency in resonant and soft-switching topologies. These characteristics allow the STGWA30IH160DF2 to be used in single-switch quasi-resonant converters over a wide switching frequency range of 16 to 60 kHz. The high breakdown voltage and thermal efficiency let the device withstand large voltage surges and spikes while minimizing reliance on external protective components.

Home appliances built with these IGBTs can compete strongly in price-sensitive markets thanks to BOM savings, while the high efficiency lets new designs achieve high energy ratings. The STGWA30IH160DF2, in production now, is available in a TO-247 long lead package from $1.98 for orders of 1,000 pieces.

About the Author

Lee Goldberg | Contributing Editor

Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.

Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.

Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.

Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.

Lee also writes the regular PowerBites series.