• GDCA
    Installing an electronic component into a military helicopter
    Supply-chain disruptions are a constant threat, but some vulnerabilities are hidden in plain sight.
    Dreamstime_oleksandrlutsenko_2220932
    Modern military and industrial electronics systems need advanced thermal management.
    Thermal management is critical for rugged-systems design, where SWaP-C (size, weight, power, and cost) constraints require innovative cooling strategies.
    William Wong © Endeavor Business Media | Adafruit, Digilent, Digi International, Mikroe, Sparkfun
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    Makers unite! Give a developer the gift of a board or module and watch them smile.
    promo_wong_holiday_gift_guide
    These are some options for makers and engineers who like to tinker.
    SiFive
    sifive_promo_hifive_premier_p550_3
    SiFive's HiFive Premier P550 Development Board delivers RISC-V plus a GPU and NPU.
    214182392 © Pavlinec | Dreamstime.com
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    Smart Modular
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    85483951 © Kuzyn - Dreamstime.com
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    6814962 © Ivra00 | Dreamstime.com and Samsung
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    This TechXchange examines the Compute Express Link (CXL) architecture and standards.
    Rugged Connectors Handle RF and Microwave Backplane Tasks
    Teledyne’s VITA 67.3-compatible connectors provide backplane RF and microwave connectivity.
    178196981 © Daniel Chetroni | Dreamstime.com
    Celebrate Pi Day with a dive into the latest Raspberry Pi releases and what looms on the horizon for the Foundation.
    307008091 © Sorinradulesku2 | Dreamstime.com
    SECO released its first SMARC system-on-modules based on Qualcomm QCS6490 and QCS5430 application processors.